The present precursors allow for a lowering of the electronic dielectric constant compared to conventional dielectric materials, such as silicon dioxide or phenyl modified organo-containing silicon dioxide.Rantala, Juha T.Low-K dielectric material. Rantala J T. U.S.Patent 7,646,081 . 2010...
Low-k dielectric materials 下载积分: 2391 内容提示: We all want our computers to work faster. The mostdirect way to increase the speed of an IC is to pack inmore transistors that are smaller and faster. For thelast two decades, device feature size has decreasedfrom 1 µm down to 90 ...
This technology is known as ‘damascene’ because Cu lines embedded in dielectric resemble damascene decoration. In the last step of the process, the dielectric must withstand mechanical stresses during the Cu removal polish. Low-k dielectric materials must also be able to survive stresses induced ...
1) low k dielectric materials 低k介质材料2) low-k dielectric 低k介质 1. The critical role of Cu/low-k dielectrics interconnections instead of conventional Al process played in the IC fabrication was demonstrated. 阐明了低k介质与铜互连集成工艺取代传统铝工艺在集成电路制造中所发挥的关键作用。
Silica zeolite low-k dielectric thin films Dielectrics, low-k; Silica films; Zeolites ZB Wang,HT Wang,AP Mitra,... - 《Advanced Materials》 被引量: 681发表: 2003年 Electrical and optical properties of diamond-like carbon Diamond-like carbon (DLC) films, amorphous hydrogenated or nonhydrogenate...
This technology is known as ‘damascene’ because Cu lines embedded in dielectric resemble damascene decoration. In the last step of the process, the dielectric must withstand mechanical stresses during the Cu removal polish. Low-k dielectric materials must also be able to survive stresses induced ...
Method for forming backend interconnect with copper etching and ultra low-k dielectric materials A method for forming a metal interconnect structure provides a copper conductive layer which is etched to form conductive lines. A low k dielectric material is provided in the spaces formed between the ...
Ultra low-k dielectric materials
The co-integration of low-K dielectric materials and Cu is still used today in the industry. Because of this architectural modification, the device manufacturers have been able to pursue Moore’s law in recent years [LE 13]. However, as characteristic dimensions are shrinking down to a few (...
Dielectric materials are vitally important in the function of microelectronic devices, as these materials electrically isolate conductive components from each other in microcircuits. Capacitance between conductors has the potential to limit a circuit’s maximum operating frequency, and capacitance increases ...