low-dielectric-materials 例句 释义: 全部 更多例句筛选 1. Low-T Sintering, Low-Dielectric Materials for High Frequency Multilayer Chip Inductors 一种低烧、低介、高频多层片式电感用的介质材料 www.ilib.cn© 2024 Microsoft 隐私声明和 Cookie 法律声明 广告 帮助 反馈...
The invention provides a low dielectric material. The low dielectric material comprises: (i) 5-50 parts by weight of polyphenylene ether (PPE) resin having a Mw of 10007000, a Mn of 1000-4000 and Mw/Mn=1.0-1.8; and (ii) 10-90 parts by weight of liquid crystal polymer with allyl ...
9, NO. 4, DECEMBER 2009 509 Integration Challenges of Nanoporous Low Dielectric Constant Materials Taek-Soo Kim and Reinhold H. Dauskardt (Invited Paper) Abstract—The reliable integration of nanoporous low dielectric constant (k) materials is challenging due to their vulnerability to delamination, ...
网络作为低介电材料 网络释义 1. 作为低介电材料 1-2-5.作为低介电材料(Low dielectric constant materials) 751-3 研究动机 77第二章 理论基础 782-1. MCM-41 之生成机构与原 … thesis.lib.cycu.edu.tw|基于 1 个网页 例句 释义: 全部,作为低介电材料...
This technology is known as ‘damascene’ because Cu lines embedded in dielectric resemble damascene decoration. In the last step of the process, the dielectric must withstand mechanical stresses during the Cu removal polish. Low-k dielectric materials must also be able to survive stresses induced ...
Fourier Transform Infrared Spectroscopy of Low-k Dielectric Material on Patterned Wafers With many of research on Fourier transform IR (FTIR) on low-k materials, our experiments extended the FTIR spectroscopy application to characterization and... JC Lam,T Hao,MY Huang,... - 《Japanese Journal ...
Novel low dielectric constant materials for use as dielectric in the dual damascene process are provided. A low dielectric constant material dielectric layer is formed by reacting a nitrogen-containing precursor and a substituted organosilane in a plasma-enhanced chemical deposition chamber. Also, novel...
- 《Annual Review of Materials Research》 被引量: 456发表: 2000年 Low dielectric constant materials prepared from soluble fullerene clusters This disclosure relates generally to polymeric networks of fullerene compounds, to methods of preparing precursors for such networks, and to their subsequent use ...
Engineering High Dielectric Constant Materials for Band-Edge CMOS Applications Brown, "Engineering high dielectric constant materials for band-edge CMOS applications," ECS Trans., vol. 16, no. 5, pp. 19-26, 2008.Metal Work Function, H. Jagannathan, V. Narayanan, S. Brown, Engineering high di...
High-performance polymer materials with low dielectric constant and low dielectric loss have been widely used in high-speed communication network. This review briefly introduces several common polymer materials, including polyimides, poly (benzoxazole)s, poly (aryl ether)s, poly (tetrafluoroethylene), ...