Atomic oxygen generated in oxygen stripping plasmas reacts with and damages low-k dielectric materials during stripping of dielectric post etch residues. W... C Paduraru,A Jensen,D Schaefer,... 被引量: 0发表: 2007年 Comparisons on Doping of Different Alkyl Compound on SiO2 to Form a Low-k...
The present precursors allow for a lowering of the electronic dielectric constant compared to conventional dielectric materials, such as silicon dioxide or phenyl modified organo-containing silicon dioxide.Rantala, Juha T.Low-K dielectric material. Rantala J T. U.S.Patent 7,646,081 . 2010...
kDielectrics:Materialsa1OutlineMotivationforlow-kdielectricsRequiredpropertiesoflow-kdielectricsProposedmaterialsMostpromisingmaterialsCVDvs.Spin-ontechniquesConclusionOutlineMotivationforlow-kdi2WhyLow-kDielectrics?ReduceRCconstantwithoutreducingsizeR metalinterconnect minimizedwithCuC dielectric needlow-kWhyLow-k...
This technology is known as ‘damascene’ because Cu lines embedded in dielectric resemble damascene decoration. In the last step of the process, the dielectric must withstand mechanical stresses during the Cu removal polish. Low-k dielectric materials must also be able to survive stresses induced ...
Low-k dielectric materials 下载积分:2391 内容提示: We all want our computers to work faster. The mostdirect way to increase the speed of an IC is to pack inmore transistors that are smaller and faster. For thelast two decades, device feature size has decreasedfrom 1 µm down to 90 ...
1、High-k与Low-k的分析 近十年来CPU业者每发表1款新主打CPU,就会顺带标榜该芯片所用的制程技术,最初只标榜尺寸缩密性制程,而近五年来更是强调各种新材质性制程,倘若不去了解新材质制程的意义,那么也将愈来愈不了解新CPU的价值意义过去IBM微电子发表Low k Dielectric(低介电质绝缘,或称:低介电常数绝缘)...
To minimize a microelectronic device’s size whilst maximizing its operating frequency, a device’s components should be separated by a material possessing a dielectric constant that is as low as possible. A class of materials referred to as ultra low-k (ULK) dielectrics are commonly used for ...
HSQ (hydrogen silsesquioxane) is one of the promising low-k materials used in VLSI technology as an intra-metal dielectric to reduce capacitance-related issues. Like any other dielectrics, the integration of HSQ in multilevel interconnect schemes has been of considerable importance. In this study,...
The co-integration oflow-K dielectricmaterials and Cu is still used today in the industry. Because of this architectural modification, the devicemanufacturers have been able to pursue Moore’s law in recent years[LE 13]. However, as characteristic dimensions are shrinking down to a few (tens ...
" # $ % & + = ' ' = ' ( ( ) * RC-Delay Power Crosstalk H W C ILD C IMD AR=H/W M1 M3 M2 EE311/ Low-k Dielectrics 4 tanford University araswat • The dielectric constant, κ, is a physical measure of the electric polarizability of a material • Electric polarizability is...