An introduction to plasma etching for VLSI circuit technology - Layadi, Colonell, et al. - 1999N. Layadi, J. I. Colonell and J. Lee, "An Introduction to Plasma Etching for VLSI Circuit Technology", Bell Labs Technical Journal, 1999, pp. 155-171....
This chapter provides an introduction to plasma etch technology focusing on various reactor configurations. The basic processes responsible for plasma etching can be described into five basic steps. These steps include generation of reactive neutral and ionic species in plasma, diffusion of the reactive...
Etching:An-IntroductionIrradiation-of-Almonds【预订】Plasma Lipoproteins, Part C: QuantitationPlasmonics 当当自营 商品详情 开本: 纸张: 包装: 是否套装: 国际标准书号ISBN:9783110569940 所属分类:图书>英文原版书>科学与技术 Science & Techology 进口书预订说明 ...
The present invention is a structure and method for controlling the depth of an etching process. In particular, the method and structure of the present invention creates a marker layer which resides between a layer to be etched and a pro... M Arienzo,DL Harame,GS Oehrlein - US 被引量: ...
Introduction to Plasma Physics and Controlled Fusion. His current interest is in plasma processing of semiconductor circuits, especially the radiofrequency sources used to make computer chips, and in the physical processes that permit etching millions of transistors on a single chip. To learn more ...
1. Introduction Polymer materials are widely used today with a multitude of applications: prostheses [1,2], medical devices [3,4], food packaging [5,6], textile industry [7,8], 3D printing [9,10], etc. In addition to bulk properties of a material, surface properties such as hydrophobic...
in plasma etching or plasma deposition, have led to a re... R Hippler,S Pfau,M Schmidt,... - Low Temperature Plasma Physics: Fundamental Aspects and Applications, by Rainer Hippler (Editor), Sigismund Pfau (Editor), Martin Schmidt (Editor), Karl H. Schoenbach (Editor), pp. 530. ISBN...
used reactive ion etching to generate microroughness on various polymer substrates and found that antibodies attached preferentially on etched PMMA, Zeonex, but as well on non-etched regions on PC surfaces. This suggested that the introduction of certain RIE-induced functional groups may play a criti...
A plasma etching method for setting a large etching ratio and forming a properly shaped hole, and a plasma etcher. For etching an etching target film (204) with a patterned organic film (202) as a mask, a treatment gas is introduced into a hermetic treatment container (104). A lower ele...
Since plasma etching is typically an isotropic process, a masking process is needed to create the appropriate surface structure (e.g. pyramids). This can be achieved on any crystalline silicon orientation by intentionally adding O2 to the etching plasma to form a residue- or etch-resistant layer...