Plasma_RIE_Etching_Fundamentals_and_Applications
Voshchenkov, FUNDAMENTALS OF PLASMA ETCHING FOR SILICON TECHNOLOGY (PART 1) , International Journal of High Speed Electronics, Vol. 1, nos. 3 & 4 (1990) 303 345.Voshchenkov, FUNDAMENTALS OF PLASMA ETCHING FOR SILICON TECHNOLOGY (PART 2), International Journal of High Speed Electronics, Vol....
Fundamentals and applications of a plasma-processing system based on electron-beam ionizationa) 来自 AIP Publishing 喜欢 0 阅读量: 30 作者:D Leonhardt,SG Walton,RF Fernsler 摘要: Plasmas generated from moderate energy ( 2 – 5 keV ) electron beams(e-beam) have unique, attractive ...
Fundamentals and Applications of Plasma Cleaning Dinesh P.R.Thanu, ...ManishKeswani, inDevelopments in Surface Contamination and Cleaning: Applications of Cleaning Techniques, 2019 2.4Advantages of Plasma Cleaning Plasma cleaningis the process of removing all unwanted contaminants from the surface of the...
J.W. Coburn, in Encyclopedia of Materials: Science and Technology, 2001 1 Plasma Etching 1.1 Fundamentals Although the term “plasma etching” is often used to describe all etching processes carried out in a reactive gas glow discharge environment, the term is also frequently used to describe et...
Partially ionized, low temperature plasmas are used extensively for thin film materials processing applications such as etching and deposition. This chapter will review some fundamental plasma concepts that are important in thin film processing applications. The partially ionized plasmas of interest here ...
Plasma processes etch anisotropically and are used to transfer patterns from photoresist to the underlying thin film materials or substrates. There are many important parameters in plasma etching, as listed below. The greatest challenge in patterning features for microelectronics application is that each ...
Plasma physics and technology; industrial applications Plasma technologies offer a wide spectrum of possible treatments of materials. In particular, in function of the peculiar physical characteristics of the p... G Bonizzoni,E Vassallo - 《Vacuum》 被引量: 141发表: 2002年 Fundamentals of Plasma ...
Part B7: Feature Evolution and Modeling. I. Fundamentals of feature evolution in plasma etching. II. Predictive modeling. III. Mechanisms of profile evolution. IV. Profile simulation. V. Plasma damage. Epilogue: Current Problems in Semiconductor Processing. I. Front-end challenges. II. Back-end ...
Fundamentals and Applications of Plasma Cleaning Dinesh P.R. Thanu, ... Manish Keswani, in Developments in Surface Contamination and Cleaning: Applications of Cleaning Techniques, 2019 4.3 Plasma Cleaning in Back End of Line Semiconductor Process Although dimensional scaling of the transistor gate lengt...