JEDEC JESD22-A113I 下载积分: 200 内容提示: JEDEC STANDARD Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing JESD22-A113I (Revision of JESD22-A113H, November 2016) APRIL 2020 JEDEC SOLID STATE TECHNOLOGY ASSOCIATION Downloaded by wang sheng (ws3640@163.com) on ...
JEDEC JESD22-A113I-2020 下载积分: 2000 内容提示: JEDEC STANDARD Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing JESD22-A113I (Revision of JESD22-A113H, November 2016) APRIL 2020 JEDEC SOLID STATE TECHNOLOGY ASSOCIATION . ...
JESD22-A111A:(Evaluation Procedure for Determining Capability to Bottom Side Board Attach by Full Body Solder Immersion of Small Surface Mount Solid State Devices)确定小型表面贴装固态器件通过全身浸渍焊料连接底侧板的能力的评价程序 JESD22-A113D:(Preconditioning of Nonhermetic Surface Mount Devices Prior...
JEDEC JESD22-B112B ：2018 Package Warpage Measurement of Surface-Mount Integrated Circuits at Elevated Temperature（高温下的表面贴装集成电路的封装翘曲测量）JESD22-B113B：2018 Board Level Cyclic Bend Test Method for Interconnect Reliability Characterization of SMT ICs for Handheld Electronic Products - ...
JESD22-A113I:2020 Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing - 可靠性测试前的非封闭表面贴装器件的预处理 JEDEC JESD22-A117E:2018 Electrically Erasable Programmable ROM (EEPROM) Program Erase Endurance and Data Retention Stress Test(电可擦除可编程 ROM (EEPROM)...
JESD22-A113I:2020 Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing - 可靠性测试前的非封闭表面贴装器件的预处理 JEDEC JESD22-A117E:2018 Electrically Erasable Programmable ROM (EEPROM) Program Erase Endurance and Data Retention Stress Test(电可擦除可编程 ROM (EEPROM)...
JESD22-A113I:2020 Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing - 可靠性测试前的非封闭表面贴装器件的预处理 JEDEC JESD22-A117E:2018 Electrically Erasable Programmable ROM (EEPROM) Program Erase Endurance and Data Retention Stress Test(电可擦除可编程 ROM (EEPROM)...
JESD22-A113I:2020 Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing - 可靠性测试前的非封闭表面贴装器件的预处理 JEDECJESD22-A117E:2018 Electrically Erasable Programmable ROM (EEPROM) Program Erase Endurance and Data Retention Stress Test(电可擦除可编程 ROM (EEPROM) ...
JEDEC JESD 22-A113 October 1, 2008 Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing This Test Method establishes an industry standard preconditioning flow for nonhermetic solid state SMDs (surface mount devices) that is representative of a typical industry multiple sol...
13 JESD22-A112 A Nov 1995 被替代 塑封表贴器件水汽诱发的应力敏感性(被J-STD-020替代) 14 JESD22-A113 I Apr 2020 现行 塑封表贴器件可靠性试验前的预处理 15 JESD22-A114 F Dec 2008 现行 静电放电敏感性试验(ESD)人体模型(HBM),2010年4月已被ANSI/ESDA/JEDEC JS-001取代。