JEDEC JESD22-A113I-2020 下载积分: 2000 内容提示: JEDEC STANDARD Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing JESD22-A113I (Revision of JESD22-A113H, November 2016) APRIL 2020 JEDEC SOLID STATE TECHNOLOGY ASSOCIATION . ...
JESD22-A113D:(Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing)可靠性测试前非密封表面贴装装置的预处理 JESD22-A113C:(Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing)可靠性测试前非密封表面贴装装置的预处理 JESD22-A113E:(Preconditioning of...
JEDEC JESD 22-A113 October 1, 2008 Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing This Test Method establishes an industry standard preconditioning flow for nonhermetic solid state SMDs (surface mount devices) that is representative of a typical industry multiple sol...
2.视觉检测 在40倍光学放大下进行外部目视检查(根据JESD22-B101或被认可的替代方案),以确保在此预处理验证中没有使用有外部裂纹或其他损伤的样品。如果发现机械不合格品,必须在生产工艺过程中实施纠正措施,并且必须从经过纠正措施处理的产品中提取新样品。如果没有工艺改善的计划,则必须保留所有的目视化不合格样品,通...
JEDEC JESD22-A111B ：2018 Evaluation Procedure for Determining Capability to Bottom Side Board Attach by Full Body Solder Immersion of Small Surface Mount Solid State Devices（通过小型表面安装固态器件的全身焊锡浸入确定底部侧板连接能力的评估程序）JESD22-A113I：2020 Preconditioning of Nonhermetic Surface ...
JESD22-A113I:2020 Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing - 可靠性测试前的非封闭表面贴装器件的预处理 JEDEC JESD22-A117E:2018 Electrically Erasable Programmable ROM (EEPROM) Program Erase Endurance and Data Retention Stress Test(电可擦除可编程 ROM (EEPROM)...
JESD22-A113,PreconditioningofNonhermeticSurfaceMountDevicesPriortoReliability Testing. JESD22-B101,ExternalVisual. JESD47,Stress-Test-DrivenQualificationofIntegratedCircuits. JESD94,ApplicationSpecificQualificationUsingKnowledgeBasedTestMethodology. J-STD-020,JointIPC/JEDECStandard,Moisture/ReflowSensitivityClassification...
13 JESD22-A112 A Nov 1995 被替代 塑封表贴器件水汽诱发的应力敏感性(被J-STD-020替代) 14 JESD22-A113 I Apr 2020 现行 塑封表贴器件可靠性试验前的预处理 15 JESD22-A114 F Dec 2008 现行 静电放电敏感性试验(ESD)人体模型(HBM),2010年4月已被ANSI/ESDA/JEDEC JS-001取代。
底部侧板连接能力评估（JEDEC JESD22-A111B）非封闭表面贴装器件的可靠性测试前预处理（JEDEC JESD22-A113I）电可擦除可编程ROM（EEPROM）的程序擦除耐久性和数据保留压力测试（JEDEC JESD22-A117E）加速的耐湿性-无偏HAST测试（JEDEC JESD22-A118B.01）低温储存寿命测试（JEDEC JESD22-A119A）有机...
JESD22-A113I:2020 Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing - 可靠性测试前的非封闭表面贴装器件的预处理 JEDEC JESD22-A117E:2018 Electrically Erasable Programmable ROM (EEPROM) Program Erase Endurance and Data Retention Stress Test(电可擦除可编程 ROM (EEPROM)...