ANSI/J–STD-006 JANUARY 1995 JOINT INDUSTRY STANDARD Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications 4th INTERIM FINAL IC I N D N U O S R T T R C I E
Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications (Incorporates Amendment 1: August 1996) IPC J-STD-006-1995 发布历史 IPC J-STD-006-1995由IPC - Association Connecting Electronics Industries 发布于 1995-01-01,并于 1998-06-...
Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications Incorporates Amendment A1 and A2: October 2009 作废 标准号 IPC J-STD-006B-2008 2008年 总页数 36页 发布单位 美国电子电路和电子互连行业协会 ...
IPC-J-STD-006B JOINT INDUSTRY STANDARD Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications IPC J-STD-006B January2006 Supersedes J-STD-006A May2001
preparation, process control or acceptance of a soldered connection. 1.4 Order of Precedence The contract always takes precedence over this standard, referenced standards and drawings. 1.5 Conflict In the event of conflict between the requirements of this standard and the applicable assembly drawing(s...
Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications 预览IPC J-STD-006C-2013前三页 标准号 IPC J-STD-006C-2013 2013年 总页数 36页 发布单位 IPC - Association Connecting Electronics Industries ...
Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications 首页 标准 IPC J-STD-006C-2013 标准全文 点击打开全屏PDF预览 点击查看大图 标准号 IPC J-STD-006C-2013 2013年 总页数 ...
Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications 作废 2006-01 预览IPC J-STD-006B-2006前三页 标准号 IPC J-STD-006B-2006 2006年 总页数 30页 发布单位 美国电子电路和电子互连行业协会 ...
IPC J-STD-006B CHINESE-2006Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications (Incorporating Amendment 1: 1/2008 and Amendment 2: 10/2009)首页标准IPC J-STD-006B CHINESE-2006...
Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications IPC J-STD-006C-2013 中,可能用到以下仪器 焊接锡膏冰箱 北京福意联医疗设备有限责任公司 国内锡膏冰箱 北京福意联医疗设备有限责任公司 ...