IPC J-STD-006C-2013 用于电子焊接应用的电子级焊料合金和助焊剂和非助焊剂固体焊料的要求 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications 预览IPC J-STD-006C-2013前三页 ...
IPC J-STD-006-1995 用于电子焊接应用的电子级焊料合金和助焊剂和非助焊剂固体焊料的要求(包含修正案 1:1996年8月) Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications (Incorporates Amendment 1: August 1996) ...
SolderLab Tests Solder for Impurities Based on J-STD-006C and J-STD-001F – Find Out How at APEXSolderLab.com
STANDARD ANSI/J–STD-006 JANUARY 1995 JOINT INDUSTRY STANDARD Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications 4th INTERIM FINAL IC I N D N U O S R T T R C
specified according to J-STD-004. Final Draft for Industry Review 11-2012 J-std-006C 1.3 Definition of Requirements The word shall is used in the text of this document wherever there is a requirement for materials, preparation, process control or acceptance of a soldered connection. ...
IPC-J-STD-006B JOINT INDUSTRY STANDARD Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications IPC J-STD-006B January2006 Supersedes J-STD-006A May2001
IPC-J-STD-001J_EN 2024 TOC Requirements for Soldered Electrical and Electronic Assemblies 这个标准是与IPC-A-610配套的。 IPC J-STD-001J因其焊接工艺和材料标准而获得全球认可。来自27个国家的参与者提供了最新的投入和专业知识。IPC J-STD-001J是电子行业中对电气和电子组件的工艺和验收标准感兴趣的人的...
IPC-J-STD-..IPC-J-STD-001H: Requirements for Soldered Electrical and Electronic Assemblies链接:https://pan.baidu.com/s/15OyH3WDe42MjsHqKAlKjxw 密码:xoym谁有中文版?
unless otherwise agreed upon between vendor and user, are to be used for each application as a default. 1.3.1 Tests with Established Accept/Reject Criteria Test A – Solder Bath/Dip and Look Test (Leaded Components and Stranded Wire) Test B – Solder Bath/Dip and Look Test (Leadless Compon...
J-STD-003B中文版.pdf,1. 概述 1.1 范围 本标准规定印制板板面导线、焊盘及镀覆孔可焊性评定的测试方法、缺陷定义和图示。本标准 适用于印制板供需双方。 1.2 目的 印制板可焊性试验的目的是在印制板制程和后续储存中,对板面上各待焊部分应未对可焊性造 成不良的影响。其可