Today, implementation of porous low-k material is mandatory in order to minimize signal propagation delay in interconnections. In this context, the traditional plasma process issues (plasma-induced damage, dime
网络延迟;连线延迟;互连线延时 网络释义 1. 延迟 联机延迟(Interconnect Delay),在布局与绕线前,组件在芯片中摆放的位置尚未确定,所以联机延迟是一个预估值。而在布 … blog.csdn.net|基于28个网页 2. 连线延迟 在「什么是STA」段落的例子中,为了方便说明,我们并没有把逻辑闸和逻辑闸间的连线延迟(Interconnect...
A method for analyzing coupling between interconnects in a VLSI processor to simulate the impact of process variations by the use of model-fitted equations to determine a delay change curve for a coupled interconnect. Simulated curves are first used to determine the parameters in the model-fitted ...
Scaledown of technology feature size decreases device delay but not interconnect delay. As a result, interconnect RC delay is becoming the performance limiting factor in the delay equation. Currently, virtually all VLSI and ULSI circuits are made with two to five levels of aluminum (Al) interconne...
1.This paper presented an innovative analytical delay model for RLC interconnects utilized in the estimation of interconnect delay for deep sub micrometer VLSI circuits.提出了用来评估深亚微米VLSI电路中RLC互连延时的一种新的解析延时模型。 英文短句/例句 1.Extreme value analysis of RLC interconnect delay...
Delay-tolerant busses(允许延迟的总线): such as AXI4-Lite (Section 3.1.5) and BVCI (described below): New commands may be issued while awaiting responses from earlier commands. Reorder-tolerant busses(允许重排序的总线): Responses can be returned in a different order from the transaction comman...
multilayer graphene nanoribbon (MLGNR) as an on-chip very-large-scale integration interconnect is proposed and its performance is analyzed in terms of delay, power dissipation, and power delay product (PDP) with variable temperatures ranging from 200K to 500K for 32nm, 22nm, and 16nm technology ...
18.E-PROPHET in Intermittently Connected Networks间断连接无线互联网下的E-PROPHET 相关短句/例句 interconnects互连线 1.On-chip Inductance Modeling of VLSI Interconnects Based on Neural Networks;基于神经网络的片上互连线电感提取法 2.Modeling ofinterconnectsand delay analysis in the presence of Random VLSI...
Reduction of Crosstalk Noise and Delay in VLSI Interconnects Using Schmitt Trigger as a Buffer and Wire Sizing With continuous scaling of integrated circuits into deep sub micron process technology, operating at gigahertz frequencies, it has become critical to deter... S Singh,VS Verma 被引量: 4...
A comparative analysis of the analytical results with SPICE simulations shows that the proposed models capture waveform shape, propagation delay, timing and noise peaks with good accuracy. It is also analyzed that crosstalk is influenced by variation in the interconnect parameters namely length, width,...