The TPG methods are implemented by the LFSR (Linear feedback shift Register) based methods for the Built in Self Test (BIST) which will reduce the complexity of VLSI Testing. A major consideration factor of thes
Crosstalk Avoidance CodesForbidden Transition FreeEncodingSystem on ChipParasiticCoupling CapacitanceDeep-submicronIJCSIRecently, reducing crosstalk noise delay is an important issue in VLSI design. As circuit geometries become smaller, wire interconnections become closer together and taller, thus increasing the...
Launch-off-shift (LOS) method provides higher fault coverage and lower pattern count when compared to launch-off-capture (LOC) method. Investigations have proven that some faults can be detected using LOC but not LOS and vice-versa. In LOS, the second pattern (i.e. patternV2) is generated...
In: Proceedings of international test conference, p 705 Savir J, Patil S (1994) On broad-side delay test. Very Large Scale Integration (VLSI) Systems 2, 368 Saxena J, Butler KM, Gatt J, Raghuraman R, Kumar SP, Basu S, Campbell DJ, Berech J (2002) Scan-based transition fault ...
A deterministic broadside test generation procedure is proposed for transition path delay faults. Under this fault model, a path delay fault is detected if and only if all the individual transition faults along the path are detected by the same test. This is important for detecting both small an...
Yi, et al., “Interconnect Delay Fault Test on Boards and SoCs with Multiple Clock Domains”, ETRI Journal, vol. 30, No. 3, Jun. 2008, pp. 403-411. Lewis, et al., “Testing Circuit-Partitioned 3D IC Designs”, In IEEE Computer Society Annual Symposium on VLSI, Tampa, FL, May 20...
al., “Evaluation of the Raw Microprocessor: An Exposed-Wire-Delay Architecture for ILP and Streams,” Proceedings of International Symposium on Computer Architecture, Jun. 2004. Taylor, Michael Bedford et. al., “Scalar Operand Networks: On-Chip Interconnect for ILP in Partitioned Architectures,...
- IEEE Vlsi Test Symposium 被引量: 28发表: 2005年 Methods for determining the depth of defects A method facilitates inspection of a component surface. The method comprises positioning a surface of the component to be inspected in an optical path of at least one infrared radiation detector, ...
19. The integrated circuit of claim 18, further comprising a delay circuit for receiving an input signal and for applying a delayed input signal to the output buffer circuit to cause the output buffer to begin a voltage state transition, wherein the input signal is applied to the surrogate ou...
the inverted state of node INiis presented to a first input of NAND gate 12b and to both inputs of the first delay stage in leg 8b; the other input of NAND gate 12b receives the inverted output of the last delay stage 14 in second leg. As such, first and second legs 8a, 8b are ...