We’ve done an analysis on Micron 176L CTF CuA 3D NAND chips which was the world’s first 176L 3D NAND Flash memory device removed from Micron 3400 1TB PCIe Gen4 NVMe 1.4 cSSD. Now, other leading 3D NAND players such as Samsung, SK hynix, KIOIXA, and Western Digital...
SK hynix 176L 3D TLC NAND Flash V7 V-NAND 3bit MLC V-NAND 3D NAND TLC Device Type Internal Solid State Drive (SSD) Internal Solid State Drive (SSD) Internal Solid State Drive (SSD) Internal Solid State Drive (SSD) Internal Solid State Drive (SSD) Model SHPP41-1000GM-2 MZ-V9P2T0CW...
笔者查询相关资料后得知P41 OEM盘PC801 1T的TLC 颗粒直写速度也在2200MB/s左右,故在此对Platinum P41 2T的颗粒用料做个判断:Wafer采用了512Gb/Die的4D V7 176Layer的颗粒,共计32Die,其中每一个Die接驳一个CE,共计32CE,吃满了Platinum P41主控ARIES白羊座32CE的带宽。 (7) 测试过程中记录到的部分温度 由于...
SK Hynix 的176L以11.01GB/mm2的存储密度一骑绝尘，高于Samsung 176L的10.87GB/mm2以及Micron 176L...
SK Hynix 的176L以11.01GB/mm2的存储密度一骑绝尘,高于Samsung 176L的10.87GB/mm2以及Micron 176L的10.27GB/mm2。 3、Windows 11测试 3.1 测试平台 ▲测试平台: CPU:AMD Ryzen 9 7900X 主板:ASRock X670E TAICHI 内存:SKhynix DDR4-4800 2RX8 UDIMM 32GB x2 显卡:PNY Geforce RTX 4080 16GB SSD:SK Hyn...
Samsung will keep the 2-deck structure even for the 238L, which is one of Samsung’s strengths in 3D NAND technology. The 162L BiCS6 3D NAND will be the 1stproduct with the CuA concept from KIOXIA/WD. Table 1. A comparison of upcoming new 3D TLC NAND chips; Samsung 176L and 238...