In addition, Cadence collaborated with TSMC to optimize the Virtuoso platform for the 79GHz mmWave design reference flow on TSMC’s N16 process. DSP IP: Cadence expanded its collaboration with TSMC’s Soft IP9000 team to certify Cadence Tensilica® DSP IP in ...
In addition, Synopsys is collaborating with TSMC on the new backside routing capabilities supporting TSMC's A16 process in the Synopsys digital design flow to address power distribution and signal routing for design performance efficiency and density optimization. Interope...
3DIC Compiler, 3DSO.ai and Multi-Physics Flow: One of the more notable announcements involved the enhancement of Synopsys’ 3DIC Compiler platform and 3DSO.ai to address the complexities of multi-die designs and offer AI-driven multi-physics analysis during the design process, helpi...
As SoIC is fabricated using "front-end" process, it can be holistically integrated into variant "back-end" advanced packaging technology platforms such as flip chip, integrated fan-out (aka InFO), 3DIC, and 2.5D with Si interposer (e.g. CoWoS™) [1-2] to provide a miniaturized and ...
Siemens and TSMC have also been working closely on advanced process certifications for Siemens’ Aprisa™ place-and-route solution, to help assist joint customers achieve smooth and rapid silicon successes with Aprisa at the foundry’s most advanced processes. “TSMC continues to develop innovative ...
These methodologies deliver 3D chip-stacking support in the System-on-Integrated-Chips (TSMC-SoIC™) technology and 2.5/3D advanced packaging support in Integrated Fan-Out (InFO) and Chip-on-Wafer-on-Substrate (CoWoS®) technologies. The coalescence of support for these advanced methodologies ...
Each interconnect technology provides the best PPACC in their own domains of AI and 5G networks, and is tightly associated with a wafer-level heterogeneous integration technology, namely CoWoS, InFO and SoIC, respectively, in HPC and mobile application systems. TSMC’s off-chip interconnect ...
TSMC drives A16, 3D process technology (Nov. 21, 2024) See Latest News>>semiwiki.com, Sept. 09, 2020 – Recently, TSMC held their 26th annual Technology Symposium, which was conducted virtually for the first time. This article is the last of three that attempts to summarize the highlights...
N6 design infrastructure: Cadence participated in an in-depth collaboration with TSMC on the design infrastructure development of this advanced process technology and has been working with customers on N6 design starts both on production designs and test chips. SoIC Design Solution: Cadenc...
N6 design infrastructure: Cadence participated in an in-depth collaboration with TSMC on the design infrastructure development of this advanced process technology and has been working with customers on N6 design starts both on production designs and test chips. SoIC Design S...