“The Cadence flow developed specifically for our InFO technology is an enabler for customers who need to increase bandwidth within small form factors,” said Suk Lee, TSMC senior director, Design Infrastructure
Application Process Core Values Relocation to Headquarter Working Environment Inclusive Workplace ESG An Innovation Pioneer A Responsible Purchaser A Practitioner of Green Power An Admired Employer Power to Change Society Research Research Areas Collaborations Careers About TSMC Company Info TSMC Museum of In...
a world leader in software and IP for semiconductor design, verification and manufacturing, today announced that it is delivering comprehensive design enablement for TSMC's 28-nanometer (nm) process technology with TSMC Reference Flow 11.0. New features of the flow include solutions for system...
"Synopsys' expertise in delivering an integrated flow from front-end to physical implementation, combined with TSMC's leadership in process technology, makes delivery of innovations that enable high-performance designs possible," said Bijan Kiani, vice president of product marketing for the Design Group...
TSMC adopted the Calibre product line because it delivers immediate availability of world-class Turn-Around Time (TAT) for large 0.25/0.18-micron System-on-Chip (SoC) designs fabricated across a variety of process technologies, including advanced logic processes, mixed-signal processes and v...
InFO_oS is integrated on a wafer base, so it can fully leverage the tools, materials, process know-how, and manufacturing capacity of InFO technology platform for design flexibility, yield and fast time to market. Through process optimization, a promising high electrical yield has been achieved ...
InFO utilizes (single or multiple) die on a carrier that are subsequently embedded in a reconstituted wafer of molding compound. The RDL interconnect and dielectric layers are subsequently fabricated on the wafer, a “chip-first” process flow. The single-die InFO provides a high-...
Reference Flow 9.0 addresses new design challenges of TSMC’s advanced technologies up to and including 40nm process technology, with features such as transparent half-node design, support for new low power automation flow via Unified Power Format (UPF) in addition to Common Power Format (CPF) en...
TSMC pioneered the pure-play foundry business model when it was founded in 1987, and has been the world’s largest dedicated semiconductor foundry ever since. The company supports a thriving ecosystem of global customers and partners with the industry’s leading process technology and portfolio of ...