Fu¨rtauer S, Li D, Cupid D et al (2013) The Cu-Sn phase diagram, part I: new experimental results. Intermetallics 34:142-147S. Fürtauer,D. Li,D. Cupid,H. Flandorfer.  The Cu–Sn phase diagram, Part I: New experimental results[J]. Intermetallics . 2013...
Phase diagram investigation of the Cu–Sn system was carried out on twenty Cu-rich samples by thermal analysis (DTA), metallographic methods (EPMA/SEM-EDX) and crystallographic analysis (powder XRD, high temperature powder XRD). One main issue in this work was to investigate the high temperature...
The 15th National Conference of Phase Diagrams of China and Multilateral Symposium 011 Phase Diagrams and Materials Design Cu.Sn二元系统相图的第一性原理研究 周伟,穆文凯,刘卫芳,刘立娟,吴萍 (天津大学理学院物理系,天津300072) 摘要:Sn基合金是目前微电子封装领域使用的的主要材料,但目前对于二元Cu-Sn系统研...
该模块可以显示四行汉字,每行可以显示8个汉字,单片机与该模块的通信采用并行方式。 图1 焊点制备示意图 Fig.1 The schematic diagram of fabricating joints 在240 ℃温度和1 N的压力下分别对Cu/Sn+Sn/Cu 结构钎焊 30,60,90,120,150,180,210,240,360,480 min,然后对每个时间下的焊点进行金相制样,通过SEM(...
2.3. Nanoparticles phase diagram modeling When the nanoparticle is assumed to be an isotropic spherical particle, the Gibbs energy of the surface GSurfaceis expressed by [17]:(9)GSurface=2σVrwhere V is the molar volume, r is the radius of the particles, and σ is the surface tension. ...
Phase diagram Cu–Sn redrawn after Knödler[55](compare Fig.1(a)) depicting in red the composition ranges within which certain types of products are obtained upon quenching β or γ phase to –183 °C and reheating to ambient temperature, at which PXRD analysis has been performed. These ...
technologyforMEMSwafer—levelpackaging.BasedonequilibriumphasediagramofCu—Snalloy,the structureoftheintermediatemulti—layersandbondingpatternsweredesigned,andthebondingprocesswas optimized.Bondinglayerwhichwasalmostvoid-free,withameltingpointof415 ℃,weresuccessfully ...
图1 焊料合金的XRD谱图Fig.1 XRD diagram of the solder alloy 图2 Sn-Cu二元相图Fig.2 Binary phase diagram for Sn-Cu 由图2可以看到,虚线为共晶成分点(Sn-0.7Cu)从熔融状态缓慢冷却,当冷却到1点时,到达共晶点,开始析出β-Sn和Cu6Sn5,即 L↔β-Sn+Cu6Sn5, 结合相图,根据杠杆原理计算,此时 w(β...
Roshanghias A, Vrestal J, Yakymovych A, Richter KW, Ipser H (2015) Sn-Ag-Cu nanosolders: melting behavior and phase diagram pre- diction in the Sn-rich corner of the ternary system. CALPHAD 49: 101-109. https://doi.org/10.1016/j.calphad.2015.04.003...
In this work, Cu-10.5 at.% Sn is selected to investigate the crystal orientation of primary phase and the occurrence of peritectic reaction during directional solidification under a transverse static magnetic field. According to the Cu-Sn phase diagram, the phase transformation of Cu-10.5 ...