For a particle radius of 10 nm the eutectic point is found at a temperature of 193.9 °C and a composition of Sn-1.8 wt% Ag-0.7 wt% Cu. This shift toward the Sn-rich corner of the phase diagram is roughly consistent with the model proposed by Lee et al. [38] for binary alloys,...
Yen, Y. W. and Chen, S. W., "Phase Equilibria of the Ag-Sn-Cu Ternary System," J. Mater. Res., Vol. 19, No. 8 (2004), pp. 2298-2305.Y.W. Yen and S.W. Chen, Phase Equilibria of the Ag–Sn–Cu Ternary System, J. Mater. Res. , 2004, 19 (8), p 2298-2305 ADS...
Ipser. Sn-Ag-Cu nanosolders: Melting behavior and phase diagram prediction in the Sn-rich corner of the ternary system. Calphad, 49(0):101-109, 2015.Roshanghias A, Vrestal J, Yakymovych A, Richter KW, Ipser H (2015) Sn-Ag-Cu nanosolders: melting behavior and phase diagram pre- ...
但熔点较高(221℃),在Cu基体上润湿性能也稍差,近年来,在二元Sn-Ag焊料的基础上开发了一系列多元合金焊料,如Sn-Ag-Cu、Sn-Ag-Zn、Sn-Ag-Bi、Sn-Ag-Sb、Sn-Ag-In、Sn-Ag-Cu-Zn等。 1.2 Sn-Ag无铅焊料的研究现状研究开发无铅焊料是我国电子材料行业面临的新课题,而Sn-Ag系是一种有希望替代铅焊料的...
SOPOUSEK, J., VRESTAL, J., ZEMANOVA, A., BURSIK, J. Phase diagram prediction and particle characterization of Sn-Ag nano alloy for low melting point lead-free solders. Journal of Mining and Metallurgy, Section B: Metallurgy 48, 419-425 (2012)....
1.2.3 润湿行为与共晶Sn-Pb相比,Sn-3.5Ag的润湿性能比较差,这是由于焊料与焊剂之间的界面张力较高,这又与Ag的高表面张力值有关。Sn-3.5Ag的润湿速度亦低于60Sn-40Pb,即使在惰性气氛中,Sn-3.5Ag的润湿行为也不会显著改善。除了Bi可能降低接触角外5,7,在Sn-3.5Ag中加入1Sb、1Cu或1In对接触角 8、影响很...
Experimental study of the Ag–Sn–In phase diagram[J] . Gueorgui P. Vassilev,Evgueni S. Dobrev,Jean-Claude Tedenac.Journal of Alloys and Compounds . 2005 (1)Gueorgui P Vassilev,Evgueni S. Dobrev,Jean-Claude Tedenac.Experimental study of the Ag-Sn-In phase diagram. Journal of Alloys and ...
Phase diagram Cu–Sn at 1 atm. (a) Version as originally constructed by Raynor[5]and adapted in modified form from[8]. Further, updates as suggested by (b) Leineweber et al.[12], (c) Liu et al.[13], and (d) Fürtauer et al.[9]are shown. All subfigures were redrawn from th...
Beijing 100124,China)Abstract :Ag 3Sn in SnAgCu solder formed by Ag and Sn has a pivotal role in reliability of solder joints due to its brittle nature and high resistivity.Therefore,it is necessary to confirm the phase transformation process and mechanism of Ag 3Sn to control its growth.The...
As part of an ongoing program on Pb-free solder phase diagrams at the National Institute of Standards and Technology, a thermodynamic model is formulated for the Sn-Bi-Ag phase diagram. Thermodynamic functions for the various phases obtained by fitting measured data for the three constituent ...