Phase Diagrams and Physical Properties of Nonequilibrium AlloysNonequilibrium Phase Diagrams of Ternary Amorphous AlloysSummary This document is part of Subvolume A 'Nonequilibrium Phase Diagrams of Ternary Amorphous Alloys' of Volume 37 'Phase Diagrams and Physical Properties of Nonequilibrium Alloys' ...
Phase diagram investigation of the Cu–Sn system was carried out on twenty Cu-rich samples by thermal analysis (DTA), metallographic methods (EPMA/SEM-EDX) and crystallographic analysis (powder XRD, high temperature powder XRD). One main issue in this work was to investigate the high temperature...
The 15th National Conference of Phase Diagrams of China and Multilateral Symposium 011 Phase Diagrams and Materials Design Cu.Sn二元系统相图的第一性原理研究 周伟,穆文凯,刘卫芳,刘立娟,吴萍 (天津大学理学院物理系,天津300072) 摘要:Sn基合金是目前微电子封装领域使用的的主要材料,但目前对于二元Cu-Sn系统研...
For a particle radius of 10 nm the eutectic point is found at a temperature of 193.9 °C and a composition of Sn-1.8 wt% Ag-0.7 wt% Cu. This shift toward the Sn-rich corner of the phase diagram is roughly consistent with the model proposed by Lee et al. [38] for binary alloys,...
Fig.1 The schematic diagram of fabricating joints 在240 ℃温度和1 N的压力下分别对Cu/Sn+Sn/Cu 结构钎焊 30,60,90,120,150,180,210,240,360,480 min,然后对每个时间下的焊点进行金相制样,通过SEM(scanning electron microscope)分析组织演变规律. ...
Phase diagram Cu–Sn redrawn after Knödler[55](compare Fig.1(a)) depicting in red the composition ranges within which certain types of products are obtained upon quenching β or γ phase to –183 °C and reheating to ambient temperature, at which PXRD analysis has been performed. These ...
a根据Sn-Cu、Ag-Sn、Sn-In二元相图可知Cu6Sn5、Ag3Sn、Ag4Sn、InSn4、In3Sn等相也都是在润湿实验结束后的冷却过程中形成的。 According to Sn-Cu, Ag-Sn, the Sn-In dual phase diagram may know Cu6Sn5, Ag3Sn, Ag4Sn, InSn4, In3Sn and so on also all is ended in after undercooling at...
图1 焊料合金的XRD谱图Fig.1 XRD diagram of the solder alloy 图2 Sn-Cu二元相图Fig.2 Binary phase diagram for Sn-Cu 由图2可以看到,虚线为共晶成分点(Sn-0.7Cu)从熔融状态缓慢冷却,当冷却到1点时,到达共晶点,开始析出β-Sn和Cu6Sn5,即 L↔β-Sn+Cu6Sn5, 结合相图,根据杠杆原理计算,此时 w(β...
Roshanghias A, Vrestal J, Yakymovych A, Richter KW, Ipser H (2015) Sn-Ag-Cu nanosolders: melting behavior and phase diagram pre- diction in the Sn-rich corner of the ternary system. CALPHAD 49: 101-109. https://doi.org/10.1016/j.calphad.2015.04.003...
摘要:研究了利用低温等温凝固技术实现Cu—sn键合在MEMS圆片级封装中的应用。基于 Cu.Sn二元平衡相图,对键合层结构进行了设计,同时设计了用于测试的键合图形,并对设计的 键合结构进行了流片实验。通过对圆片制作及键合等工艺的一系列优化,在250℃的低温条件下 ...