SOPOUSEK, J., VRESTAL, J., ZEMANOVA, A., BURSIK, J. Phase diagram prediction and particle characterization of Sn-Ag nano alloy for low melting point lead-free solders. Journal of Mining and Metallurgy, Section B: Metallurgy 48, 419-425 (2012)....
For a particle radius of 10 nm the eutectic point is found at a temperature of 193.9 °C and a composition of Sn-1.8 wt% Ag-0.7 wt% Cu. This shift toward the Sn-rich corner of the phase diagram is roughly consistent with the model proposed by Lee et al. [38] for binary alloys,...
Experimental study of the Ag–Sn–In phase diagram[J] . Gueorgui P. Vassilev,Evgueni S. Dobrev,Jean-Claude Tedenac.Journal of Alloys and Compounds . 2005 (1)Gueorgui P Vassilev,Evgueni S. Dobrev,Jean-Claude Tedenac.Experimental study of the Ag-Sn-In phase diagram. Journal of Alloys and ...
图1-1 Au-Sn合金二元相图 Fig.1-1 Binary phase diagram of Au-Sn alloy 1.3.3 AuSn焊片的应用由于金锡共晶焊料的熔点(280℃)比96.5%Sn3.5%Ag锡银共晶焊料(221℃)要高很多,因此它不能和广泛应用于电子封装的有机材料在同一温度下配合使用。然而,金锡钎焊料对于一些同时要求机械性能及导热性能好以获得高可靠...
图1-1 Au-Sn合金二元相图Fig.1-1 Binary phase diagram of Au-Sn alloy1.3.3 AuSn焊片的应用由于金锡共晶焊料的熔点(280)比96.5Sn3.5Ag锡银共晶焊料(221)要高很多,因此它不能和广泛应用于电子封装的有机材料在同一温度下配合使用。然而,金锡钎焊料对于一些同时要求机械性能及导热性能好以获得高可靠性的应用来...
Roshanghias A, Vrestal J, Yakymovych A, Richter KW, Ipser H (2015) Sn-Ag-Cu nanosolders: melting behavior and phase diagram pre- diction in the Sn-rich corner of the ternary system. CALPHAD 49: 101-109. https://doi.org/10.1016/j.calphad.2015.04.003...
a thermodynamic model is formulated for the Sn-Bi-Ag phase diagram. Thermodynamic functions for the various phases obtained by fitting measured data for the three constituent binary systems are extrapolated to the ternary system using the method of Muggianu. Modeling results are compared to preliminary...
As part of an ongoing program on Pb-free solder phase diagrams at the National Institute of Standards and Technology, a thermodynamic model is formulated for the Sn-Bi-Ag phase diagram. Thermodynamic functions for the various phases obtained by fitting measured data for the three constituent ...
摘 要:SnAgCu 焊点中的金属间化合物(intermetallic compounds,IMCs)Ag 3Sn 脆性大且电阻高,对焊点可靠性具有重要影响,有必要明确其形成过程和相变机制以控制其生长.采用固体与分子经验电子理论(empirical electron theory,EET)研究Ag⁃Sn 系统中的主要扩散元素及原子运动路径,应用自洽键距差(self⁃consistent bond ...
Ag-Sn低温过渡液相连接中Ag3Sn晶粒的生长机理