SOPOUSEK, J., VRESTAL, J., ZEMANOVA, A., BURSIK, J. Phase diagram prediction and particle characterization of Sn-Ag nano alloy for low melting point lead-free solders. Journal of Mining and Metallurgy, Section B: Metallurgy 48, 419-425 (2012)....
For a particle radius of 10 nm the eutectic point is found at a temperature of 193.9 °C and a composition of Sn-1.8 wt% Ag-0.7 wt% Cu. This shift toward the Sn-rich corner of the phase diagram is roughly consistent with the model proposed by Lee et al. [38] for binary alloys,...
Roshanghias A, Vrestal J, Yakymovych A, Richter KW, Ipser H (2015) Sn-Ag-Cu nanosolders: melting behavior and phase diagram pre- diction in the Sn-rich corner of the ternary system. CALPHAD 49: 101-109. https://doi.org/10.1016/j.calphad.2015.04.003...
Experimental study of the Ag–Sn–In phase diagram[J] . Gueorgui P. Vassilev,Evgueni S. Dobrev,Jean-Claude Tedenac.Journal of Alloys and Compounds . 2005 (1)Gueorgui P Vassilev,Evgueni S. Dobrev,Jean-Claude Tedenac.Experimental study of the Ag-Sn-In phase diagram. Journal of Alloys and ...
图1-1 Au-Sn合金二元相图 Fig.1-1 Binary phase diagram of Au-Sn alloy 1.3.3 AuSn焊片的应用由于金锡共晶焊料的熔点(280℃)比96.5%Sn3.5%Ag锡银共晶焊料(221℃)要高很多,因此它不能和广泛应用于电子封装的有机材料在同一温度下配合使用。然而,金锡钎焊料对于一些同时要求机械性能及导热性能好以获得高可靠...
图1-1 Au-Sn合金二元相图Fig.1-1 Binary phase diagram of Au-Sn alloy1.3.3 AuSn焊片的应用由于金锡共晶焊料的熔点(280)比96.5Sn3.5Ag锡银共晶焊料(221)要高很多,因此它不能和广泛应用于电子封装的有机材料在同一温度下配合使用。然而,金锡钎焊料对于一些同时要求机械性能及导热性能好以获得高可靠性的应用来...
The maximum bubble pressure method has been used to measure the surface tension of pure antimony and the surface tension and density (dilatometric method) of Sn-3.8 at%Ag eutectic base alloys with 0.03, 0.06 and 0.09 molar fraction of antimony at a temperature range from 550 to 1200K. The...
(Equi Diagram; Experimental) Article Google Scholar 61Bet: J. O. Betterton, Jr. and D. S. Easton, “Lattice Constants of Alpha Zirconium Alloys with Additions of Ag, Cd, In, Sn and Sb”,J. Met., 13, 86 (1961). (Crys Structure; Experimental) Google Scholar 61Fed: G. B. ...
Ag-Sn焊料因其优异的综合性能,已替代传统Pb-Sn焊料并广泛应用于电子电路和电子封装领域.Ni/Pd金属涂层可有效提高焊点的可靠性以及使用寿命.精确的焊料体系相图热力学研究可为焊料成分的高效设计,焊料工艺参数优化及焊点可靠性的提高提供热力学基础.本工作基于CALPHAD(CALculation of PHAse Diagram)方法对Ag-Ni-Pd-Sn焊...
(3) The phase diagram of the electrodeposited Sn–Ag alloys resemble the equilibrium phase diagram of the Sn–Ag alloys. 展开 关键词: tin-silver alloy electrodeposition method morphology phase microstructure phase diagram DOI: 10.2320/matertrans1989.39.439 被引量: 3 ...