We have developed the eutectic Sn-Ag solder bump process for high pin count ULSIs which require Flip Chip interconnection. In the 2-step electroplating process using separate reactors for Ag and Sn each, the Sn-Ag alloy composition can be easily controlled by varying the thickness ratio of Ag...
Sn-3.5AG Solder Bar Lead-Free Solder Bar, Find Details and Price about Welding Welder from Sn-3.5AG Solder Bar Lead-Free Solder Bar - Guangdong Zhong Shi Metals Co., Ltd
Name Lead-free solder paste Alloy Sn-1.0Ag-0.5Cu Material Tin Package 500g/bottle Melting point 217-224ºC Particles 25 - 45um(custom made) Application scenario Widely used in SMT industry. Suitable for smart phone, tablet computer, computer motherboard, compute...
3) lead-free solder of Sn-Ag-Cu Sn-Ag-Cu系无铅焊料 4) Sn-Ag-Cu series Sn-Ag-Cu系 1. Measurement of mechanical properties ofSn-Ag-Cu serieslead-free solder alloy by using micro-indentation; 微观压痕法测量Sn-Ag-Cu系无铅钎料的力学性能 ...
The eutectic Sn-3.5wt.%Ag solder alloy is expected to be one of the candidates for Pb-free solder bump materials. But it is difficult for the conventional Sn-Ag alloy plating method to obtain eutectic composition with good uniformity within wafer, and to control the composition of plating sol...
A Pb-free solder includes a ternary eutectic composition consisting essentially of about 93.6 weight % Sn-about 4.7 weight % Ag- about 1.7 weight % Cu having a eutectic melting temperature of about 217° C. and variants of the ternary composition wherein the relative concentrations of Sn,...
microstructure and tensile behavior of a Sn-3.5 wt.% Ag solder. J Electron Mater, 2003, 32: 1414—1420 6 Ochoa F, Williams J J, Chawla N. Effect of cooling rate on the microstructure and mechanical behavior of Sn-3.5Ag solder. JOM, ...
供应千住SMIC 无铅 含银 焊锡条/焊锡棒ECO SOLDER BAR M705E 深圳市信德工业材料有限公司4年 月均发货速度:暂无记录 广东 深圳市宝安区 ¥168.00成交131个 现货供应无铅高温含银锡膏 Sn99Ag0.3Cu0.7环保高温锡膏 焊点光亮 深圳市宏达锡制品有限公司9年 ...
Tin-lead solder has a long history as a main brazing material in electronics assembly. Sn63Pb37 eutectic solder has a low melting temperature(183℃) and good welding performance(e.g. excellent wettability and low surface tension), which
The creep behavior of the eutectic tin-silver joints and tin-silver composite solder joints containing 20 vol.% of Cu6Sn5, Ni3Sn4, and FeSn2 intermetallic reinforcements introduced by in-situ methods was investigated. These creep tests were carried out using single shear lap solder joints at ...