A significant change in surface morphology and alloy composition was observed with increasing current density. A displacement reaction also occurred between the tin anode and the silver ions in the bath. With the wafer-scale deposition of SnPb solder, we observed that (ⅰ) organic components had...
structure of the solder maintains to be stable for the A93Sn nanoparticles distributing only in the eutectic zone. At last,the possible governing of the formation of bulk IMCs was proposed by adding a small amount of third component(Cu,In and Zn)or Zr02 nanoparticles in ...
This product uses alloy SnAg0.3Cu0.7 to make solder bar, which is suitable for the welding manufacturing process of electronic products. The alloy composition conforms to the GB/T3131-2001 alloy composition specification standard. alloy properties 1. Alloy melting point: 217℃-227℃ 2. Alloy...
Pb-free solderpackagingelectroplating solderEutectic Sn-3.5wt.%Ag alloy is one of the most promising lead-free solders in low temperature processes for wafer bumping. Near eutectic composition of deposited alloy films could be readily acquired by pulse electroplating with a pro...
Electrochemical processes are commonly used for the solder deposition, but it is difficult to adjust the composition ratio in the deposited binary and ternary metal compounds with this method. In this paper, we report the evaluation of different metallization schemes with Ni- or Cu-studs beneath ...
The IMC growth of fine pitch Cu pillar/SnAg solder bumps used for the chip to chip eutectic bonding of 3D-TSV interconnection was investigated. Most of SnAg solder was rapidly consumed by Cu-Sn intermetallic compound (IMC) growth during the eutectic bonding process. The composition of the IMC...
Anisotropic behavior of Sn based solder during electromigration has been studied by many researchers, and it is very important to control the microstructure for more reliable bump joints[1]. Here, we prepared various SnAg bumps with different Ag concentrations including pure Sn[2]. Unary ...
Near eutectic tin-silver (SnAg) is currently the alloy of choice for electroplated lead-free solder bumping and Cu pillar capping. While lead-tin (PbSn) is still used in some applications, there has been considerable momentum in moving away from the use of lead in semiconductor packaging. ...
Auger electron spectroscopy (AES) technologywas utilized to investigate the oxidation behavior of SnAgTi solder by means of characterizing the chemical composition and the thickness of the oxide layer. The effect of Ti and Y elements on oxidation behavior was discussed. Cu and 1Cr18Ni9Ti was solder...
Pb-free SnAg solder has become the industry standard for fabricating flip chip interconnects utilizing C4 (controlled collapse chip connection) technology. One area of interest for manufacturability of Pb-free solders is the ability to control and measure the %Ag composition and its variation from...