Sub 100 micron lead-free solder bumping and its related interconnection & reliability is becoming one of the important issues in today''s electronic packaging industry. In this paper, a SnAg solder bumping area-array of 13 times 13 with the bump size less than 100mum on the TiW/Cu UBM ...
The company's main products are: solder paste, solder wire, solder bar, BGA solder ball, anode rod, flux, the red plastic and other electronic tin solder, the annual production capacity of more than 6000 tons. Product Parameters Ingredient SnAg0.3Cu0.7 (SAC...
Effects of cracks on the whiskers growth were carefully observed and discussed, and it was found that cracks under a certain width could exempt the breaking of the oxidation layer at the solder surface, thus help the whiskers growth. On the other hand, wide cracks might accommodate the ...
日本千住无铅含银焊锡丝/焊锡线ECO SOLDER NEO F3 M35 深圳市新诚丰工业材料有限公司18年 回头率:33.3% 广东 深圳市宝安区 ¥50.0成交0件 锡线宇航工厂定制含银无铅焊锡丝焊铝环保锡线支持制定 深圳市宇航金属新材料有限公司8年 回头率:0% 广东 深圳市 ...
Stainless Steel Bright Black Round Bar, Flat Bar, Angle Bar, Square Bar, Solder Bar Product Description Company Info Basic Info. Model NO. SnAg3.0Cu0.5 Type E (Carbon Steel Electrodes/ Low Alloy Steel Electrodes) Material Copper / Copper Alloy Diameter 32cm Long Length ...
The true: + 86-769-85300726 E-mail:info@dgqihang.com Web site: www.dgqihang.com Address: No.1 Xiagang Industrial Zone, Chang 'an Town, Dongguan City Home>Product>Solder Bar>Lead-free tin rod>SnAg0.3Cu0.7 Service Hotline:+86-769-85300736 ...
A technique for the formation of self-aligning Sn-Ag solder balls is presented. By controlling the solder reflow conditions through the optimization of the solder adhesion to the surface, a very thin layer of solder can be used. This makes possible the use of conventional photolithography and me...
日本千住无铅焊锡线/焊锡丝ECO SOLDER RMA02 M35 0.3-1.6MM 系列 深圳市国建电子有限公司3年 回头率:0% 广东 深圳市宝安区 ¥317.0成交0件 兴鸿泰厂家批发无铅环保焊锡丝1.0mm 0.8mm活性免清环保含银锡线 深圳市兴鸿泰锡业有限公司16年 回头率:18.5% ...
Moreover, the crack propagation rate of PbSnAg solder layer under thermal cycling was described based on the calculation of mechanical parameter Δ J integral. [ 展开 关键词: Pb5Sn2.5Ag solder thermal cycling crack propagation viscoplastic Δ J integral ...
千住金属所开发出之无铅锡膏「ECO SOLDER PASTE」比较之前的锡膏,是对于无铅化所产生的问题,如保存安定性、供锡安定性、润湿性及高融点化之耐热性等问题,都能得到解決之新世代环保锡膏。日本千住金属的锡膏使用氧化极微之SOLDER POWDER和优良化学安定性之FLUX组合而成,不仅可靠性高,具有良好的保存稳定性,同时具有良好...