The present precursors allow for a lowering of the electronic dielectric constant compared to conventional dielectric materials, such as silicon dioxide or phenyl modified organo-containing silicon dioxide.Rantala, Juha T.Low-K dielectric material. Rantala J T. U.S.Patent 7,646,081 . 2010...
How to reduce k-value Dielectric constant k (also called relative permittivity εr) is the ratio of the permittivity of a substance to that of free space. A material containing polar components, which are represented as electric dipoles (e.g. polar chemical bonds), has an increased dielectric...
Dielectric constant k (also called relative permittivity ϵr) is the ratio of the permittivity of a substance to that of free space. A material containing polar components, which are represented as electric dipoles (e.g. polar chemical bonds), has an increased dielectric constant (Fig. 3)....
Insemiconductormanufacturing,aLow-κdielectricisamaterialwithasmalldielectricconstant relativetosilicondioxide.AlthoughthepropersymbolforthedielectricconstantistheGreek letterκ(kappa),inconversationsuchmaterialsarereferredtoasbeing"low-k"(low-kay)rather than"low-κ"(low-kappa).Low-κdielectricmaterialimplementation...
[0016] Process for Preparing Ultra Low-k Dielectric Material [0017] The process involves preparing a blend solution of (1) a thermally stable, low dielectric constant, organic-inorganic hybrid host polymer, (2) a thermally degradable organic polymer acting as a porogen (i.e. a porosity-induc...
Machetta P, M Lazzarino, S Carrato, C Schmidt, G Canil, V Kapeliouchko, T Poggio and A Sanguineti, ‘PTFE nanoemulsions as ultralow-k dielectric material’, Macromolecular Symposia , 179 , 347–58, 2002Machetta, P., Lazzarino, M., Carrato, S., Schmidt, C., Canil, G., Kapeli...
(PMI) Material for Laboratory Test Datasheet S10 C15 In Compliance with > GB/T 9254 > GB/T18655 > ISO 10605 > ISO 11452-4 > GJB 151B >GB/T 21437.2 >GB/T 21437.3 Introduction Low-k dielectric material for laboratory test adopts material with dielectric constant (εr) less than or ...
1.1 Introduction to low k dielectric/interconnect technology 1 1.2 The ideal dielectric material 1 1.3 Motivation & objective of thesis 3 1.4 Thesis overview 6 CHAPTER 2 LITERATURE REVIEW 8 2.1 Review of technical challenges and issues on low k dielectric material 8 2.2 Comparison of ...
To minimize a microelectronic device’s size whilst maximizing its operating frequency, a device’s components should be separated by a material possessing a dielectric constant that is as low as possible. A class of materials referred to as ultra low-k (ULK) dielectrics are commonly used for ...
31 Jul. 2004SUMITOMO BAKELITE3Back ground 2 : What is low k ?k<3.0 Porous SiO2 (SiOC)k=3.4~3.6 SiOF (FSG)k=4.0 SiO2How to decrease k (dielectric constant) value ?Lower polarizabilityLower densitySiOF (FSG)Porous SiO2Air : k=1.0 * How to make much more air hole ….....