JESD22-A113-D
JEDEC STANDARD Temperature Cycling JESD22-A104C (Revision of JESD22-A104-B) MAY 2005 JEDEC SOLID STATE TECHNOLOGY ASSOCIATION NOTICE JEDEC standards and publications contain material that has been prepared, reviewed, and approved through the JEDEC Board of Directors level and subsequently reviewed and...
JEDEC STANDARD Temperature Cycling JESD22-A104C (Revision of JESD22-A104-B) MAY 2005 JEDEC SOLID STATE TECHNOLOGY ASSOCIATION
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JESD22A105C Power and Temperature Cycling 热度: JEDEC STANDARD TemperatureCycling JESD22-A104C (RevisionofJESD22-A104-B) MAY2005 JEDECSOLIDSTATETECHNOLOGYASSOCIATION NOTICE JEDECstandardsandpublicationscontainmaterialthathasbeenprepared,reviewed,and
Test Method A104C (Revision of Test Method A104-B) JEDEC Standard No. 22-A104C Page 5 4 Procedure (cont’d) Table 1 — Temperature cycling test conditions Test Nominal Nominal Condition* Ts(min)(°C) with Tolerances Ts(max)(°C) with Tolerances A -55(+0, -10) +85(+10, -0) B...
A104 TEMPERATURECYCLING:温度循环: Thisstandardprovidesamethodfordeterminingsolidstatedevices本标准提供了一种用于确定固态器件耐受极限温度循环能力的 capabilitytowithstandextremetemperaturecycling.Changesinthis方法。在本修订版中,改变之处包括最坏条件下,加载温度而温度循环 ...
JESD22标准 Name Name Abbreviatio A100循环温湿度偏置寿CycledTemperature-Humidity-Bias 命 LifeTest A101稳态温湿度偏置寿命 STEADY-STATETEMPERATURE-HUMIDITYBIAS LIFETEST THB A102加速水汽抵抗性-无偏置高压蒸煮 ACCELERATEDMOISTURERESISTANCE-UNBIASED AUTOCLAVE A103高温贮存寿命 HIGHTEMPERATURESTORAGELIFE HTSL A104温度...
3.2TC(Temperaturecycle)---温度循环,标准JESD22-A104 从低温到高温循环,温度变化较慢,衡量芯片承受冷热冲击的能力。一般为-45°C~125°C,1000循环;也有些客户要求-60°C~125°C,500循环。 3.3TS(Temperatureshock)-温度冲击,标准为JESD22-A106 快速从低温到高温,检验芯片的抗温度冲击能力。一般要求-45°C~125...
C Mar 2009 现行 稳态温湿度偏置寿命 3. A102 D Nov 2010 现行 加速水汽抵抗性-无偏置高压蒸煮 4. A103 D Dec 2010 现行 高温贮存寿命 5. A104 D Mar 2009 现行 温度循环 6. A105 C Jan 2004 现行 上电温循 7. A106 B Jun 2004 现行 热冲击 8. A107 C Apr 2013 现行 盐雾 9. A108 D Nov 20...