内容提示: JEDEC STANDARD Evaluation Procedure for Determining Capability to Bottom Side Board Attach by Full Body Solder Immersion of Small Surface Mount Solid State Devices JESD22-A111B (Revision of JESD22-A111A, November 2010) MARCH 2018 JEDEC SOLID STATE TECHNOLOGY ASSOCIATION Downloaded by wang...
JEDEC JESD22-A111B ：2018 Evaluation Procedure for Determining Capability to Bottom Side Board Attach by Full Body Solder Immersion of Small Surface Mount Solid State Devices（通过小型表面安装固态器件的全身焊锡浸入确定底部侧板连接能力的评估程序）JESD22-A113I：2020 Preconditioning of Nonhermetic Surface ...
JESD22-A111A:(Evaluation Procedure for Determining Capability to Bottom Side Board Attach by Full Body Solder Immersion of Small Surface Mount Solid State Devices)确定小型表面贴装固态器件通过全身浸渍焊料连接底侧板的能力的评价程序 JESD22-A113D:(Preconditioning of Nonhermetic Surface Mount Devices Prior...
JEDEC JESD22-A111B :2018 Evaluation Procedure for Determining Capability to Bottom Side Board Attach by Full Body Solder Immersion of Small Surface Mount Solid State Devices(通过小型表面安装固态器件的全身焊锡浸入确定底部侧板连接能力的评估程序) JESD22-A113I:2020 Preconditioning of Nonhermetic Surface M...
JEDEC JESD22-A109B:2011 HERMETICITY(气密性) JEDEC JESD22-A110E.01:2020 Highly Accelerated Temperature and Humidity Stress Test (HAST) -高加速温度和湿度应力测试 (HAST) JEDEC JESD22-A111B :2018 Evaluation Procedure for Determining Capability to Bottom Side Board Attach by Full Body Solder Immersio...
JEDEC JESD22-A111B :2018 Evaluation Procedure for Determining Capability to Bottom Side Board Attach by Full Body Solder Immersion of Small Surface Mount Solid State Devices(通过小型表面安装固态器件的全身焊锡浸入确定底部侧板连接能力的评估程序) ...
高加速温度和湿度应力测试（JEDEC JESD22-A110E.01）底部侧板连接能力评估（JEDEC JESD22-A111B）非封闭表面贴装器件的可靠性测试前预处理（JEDEC JESD22-A113I）电可擦除可编程ROM（EEPROM）的程序擦除耐久性和数据保留压力测试（JEDEC JESD22-A117E）加速的耐湿性-无偏HAST测试（JEDEC JESD22-A118...
内容提示: JEDEC STANDARD Board Level Drop Test Method of Components for Handheld Electronic Products JESD22-B111A (Revision of JESD22-B111, July 2003) NOVEMBER 2016 JEDEC SOLID STATE TECHNOLOGY ASSOCIATION Downloaded by wang xue (thoosiau@gmail.com) on Jul 12, 2020, 9:59 pm PDTHGG ...
JEDEC Std JESD22-A114A (C1 = 100 pF, R1 = 1500 Ω, and R2 = 500 Ω). 2. Positive and negative pulses applied on different combinations of pin connections, according to AECQ100-002 (compliant with JEDEC Std JESD22-A114, C1 = 100 p...
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