JEDEC JESD22-B103B.01：2016 Vibration, Variable Frequency（振动，变频）JEDEC JESD22-B105E：2018 Lead Integrity（引线完整性）JEDEC JESD22-B106E：2016Resistance to Solder Shock for Through-Hole Mounted Devices （通孔安装器件的抗焊接冲击性 ）JEDEC JESD22-B107D：2011 Mark Permanency（标记永久性）J...
JEDEC JESD22-A111B :2018 Evaluation Procedure for Determining Capability to Bottom Side Board Attach by Full Body Solder Immersion of Small Surface Mount Solid State Devices(通过小型表面安装固态器件的全身焊锡浸入确定底部侧板连接能力的评估程序) JESD22-A113I:2020 Preconditioning of Nonhermetic Surface M...
JEDEC JESD22-B105E:2018 Lead Integrity(引线完整性) JEDEC JESD22-B106E:2016Resistance to Solder Shock for Through-Hole Mounted Devices (通孔安装器件的抗焊接冲击性 ) JEDEC JESD22-B107D:2011 Mark Permanency(标记永久性) JEDEC JESD22-B108B:2010 Coplanarity Test for Surface-Mount Semiconductor Devi...
JEDEC JESD22-B112B :2018 Package Warpage Measurement of Surface-Mount Integrated Circuits at Elevated Temperature(高温下的表面贴装集成电路的封装翘曲测量) JESD22-B113B:2018 Board Level Cyclic Bend Test Method for Interconnect Reliability Characterization of SMT ICs for Handheld Electronic Products - 用...
JEDEC JESD22-A109B-2011由(美国)固态技术协会,隶属EIA US-JEDEC 发布于 2011-11-01。JEDEC JESD22-A109B-2011 气密性的最新版本是哪一版?JEDEC JESD22-A109B-2011已经是当前最新版本。标准号 JEDEC JESD22-A109B-2011 发布 2011年 发布单位 (美国)固态技术协会,隶属EIA 购买 正式版JEDEC...
JEDEC JESD22-A103E:2015 High Temperature Storage Life(高温储存寿命)- 完整英文版(9页).pdf,JEDEC STANDARD High Temperature Storage Life JESD22-A103E (Revision of JESD22-A103D, December 2010) OCTOBER 2015 JEDEC SOLID STATE TECHNOLOGY ASSOCIATION NOTICE
JEDEC JESD22-A109B:2011 HERMETICITY(气密性) JEDEC JESD22-A110E.01:2020 Highly Accelerated Temperature and Humidity Stress Test (HAST) -高加速温度和湿度应力测试(HAST) JEDEC JESD22-A111B :2018 Evaluation Procedure for Determining Capability to Bottom Side Board Attach by Full Body Solder Immersion...
JEDEC JESD22-A109B:2011 HERMETICITY JEDEC JESD22-A110E.01:2020 Highly Accelerated Temperature and Humidity Stress Test (HAST) JEDEC JESD22-A111B :2018 Evaluation Procedure for Determining Capability to Bottom Side Board Attach by Full Body Solder Immersion of Small Surface Mount Solid State Devices...
JEDEC JESD22-A109B:2011 HERMETICITY(气密性) JEDEC JESD22-A110E.01:2020 Highly Accelerated Temperature and Humidity Stress Test (HAST) -高加速温度和湿度应力测试 (HAST) JEDEC JESD22-A111B :2018 Evaluation Procedure for Determining Capability to Bottom Side Board Attach by Full Body Solder Immersio...
JESD22-A106B.01:2016 Thermal Shock(热冲击) JESD22-A107C:2013 Salt Atmosphere(盐雾) JESD22-A108F:2017 Temperature, Bias, And Operating Life(温度,偏置和使用寿命) JESD22-A109B:2011 HERMETICITY(气密性) JESD22-A110E.01:2020 Highly Accelerated Temperature and Humidity Stress Test (HAST) -高加速...