5.Type V:via孔被完全填充和封装。 06 6.Type VI-a:在Type V基础上单面盖阻焊(湿膜或干膜)。 Type VI-b:在Type V基础上双面盖阻焊(湿膜或干膜)。 07 7.Type VII:在Type V基础上电镀覆盖/电镀填平 - Type I -a,Type I -b:不能制作。通常工厂不使用阻焊干膜。 -Type II -a,Type II -b:不...
pour the resin on IPC-4761 type VII.翻译为：树把脂倒在ipc-4761 VII上 【附】pour 英[pɔ:(r)] 美[pɔr, por]vt. 涌出; 倾，倒;vi. 涌流; 泛滥，涌出; 斟，倒;n. 倾泻;[例句]Pour a pool of sauce on two plates and arrange the meat neatly 在...
A Type V via with a secondary covering of material (liquid or dry film soldermask) applied over the via. The covering material may be applied from either one side (Type VI-a) or both sides (Type VI-b) of the via structure: Process: Application of mask over Type V. Fill material can...
orsqueegeed.VIVI-aFilledandCoveredViaDryFilmCoverATypeVviawithasecondarycoveringofmaterial(liquidordryfilmsoldermask)appliedoverthevia.Thecoveringmaterialmaybeappliedfromeitheroneside(TypeVI-a)orbothsides(TypeVI-b)oftheviastructure:Process:ApplicationofmaskoverTypeV.Fillmaterialcanbeelectricallyand/orthermally...
這份IPC-4761印刷電路板導通孔結構建保護指引(Design Guide for Protection of Printed Board Via Structures)文件其實已經是2006年的老版本了,距今沒有更新。它定義了幾種導通孔保護(via protection)的方法,也定義了6種導通孔保護的型態(type)。 說白話一點,導通孔保護其實就是我們一般認知的【塞孔】,只是文件中用...
4.Type IV-a:在Type III-a基础上,单面塞孔面盖阻焊。 Type IV-b:在Type III-b基础上,双面塞孔面盖阻焊。 05 5.Type V:via孔被完全填充和封装。 06 6.Type VI-a:在Type V基础上单面盖阻焊(湿膜或干膜)。 Type VI-b:在Type V基础上双面盖阻焊(湿膜或干膜)。
A Type V via with a secondary covering of material (liquid or dry film soldermask) applied over the via. The covering material may be applied from either one side (Type VI-a) or both sides (Type VI-b) of the via structure: Process: Application of mask over Type V. Fill material can...