1. Type I-a:在via孔的单面盖阻焊干膜,不允许额外的材料入孔。 Type I-b:在via孔的双面盖阻焊干膜,不允许额外的材料入孔。 02 2. Type II-a:在Type I-a的基础上,干膜上盖阻焊。 Type II-b:在Type I-b的基础上,干膜上盖阻焊。 03 3.Type III-a:via孔单面塞孔,via孔表面不盖阻焊。 Type II...
IPC-4761 via typeType Cat Description figure process Remark I I-a Tented Via Tented Via (Type I Via): A via with a dry film mask material applied bridging over the via wherein no additional materials are in the hole. It may be applied to one side (Type I-a) or both sides (Type ...
AD支持符合 IPC-4761 的过孔类型。 配置过孔保护类型: 选择所需的过孔; 在属性面板中设置一个类型; 在表中指定涂层面和材料。 当过孔类型设置为 IPC-4761 时,新类型的机械层和元件层对会自动添加到设计中,并在这些层上具有相应的形状。 在为制造创建输出文件以及在 Draftsman 中创建绘图时,也支持过孔保护类型。
TypeVviawithasecondarycoveringofmaterial(liquidordryfilmsoldermask)appliedoverthevia.Thecoveringmaterialmaybeappliedfromeitheroneside(TypeVI-a)orbothsides(TypeVI-b)oftheviastructure:Process:ApplicationofmaskoverTypeV.Fillmaterialcanbeelectricallyand/orthermallyconductivedependingonenduse.VIVI-bFilledandCoveredVia...
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Filled, Plugged, Plated Via‐In‐Pad, and … IPC 4761 John Steinar Johnsen,‐ Josse‐, November 2010 Increasing use of High Density Interconnect Printed Circuit Boards (HDI PCBs), the plugging of microvias has become an inevitable subject for many manufacturers of PCBs. And it is as always ...
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1 评论次数: 0 文档热度: 文档分类: 行业资料--国内外标准规范 文档标签: 印制电路板SMT 系统标签: ipcmanualstandardsanodischesphototoolcaf IPCStandardsManualPRODUCTTYPE:ALL1ProductCodeClickonTitletoviewdetails1751A(D)FGenericRequirementsforDeclarationProcessManagement-includesAmendment11756(D)FManufacturingProcessDa...
這份IPC-4761印刷電路板導通孔結構建保護指引(Design Guide for Protection of Printed Board Via Structures)文件其實已經是2006年的老版本了,距今沒有更新。它定義了幾種導通孔保護(via protection)的方法,也定義了6種導通孔保護的型態(type)。 說白話一點,導通孔保護其實就是我們一般認知的【塞孔】,只是文件中用...
Eagle Electronics is now offering 3 day turns, for qualified prototype orders, which require via fill per IPC-4761 type VII. The demand for quick turn via-in-pad technology has grown exponentially over the past several years and Eagle Electronics is providi...