最后,敲黑板划重点来了,按照不同损耗及不同厂家的材料名称,我们做了如下的一个材料金字塔,主要还是基于损耗比普通FR4小的常用中高速板材,而普通的FR4,比如IT180A、S1000-2/M、Tu752/768等,这些Df基本上差异不大,也是我们目前使用最多的几种Hi-Tg板材。 备注:以上材料,排名不分先后,同时部分材料没有更新上去。
FR4 PCBs are made up of a square grid glass strands woven together. This sheet of woven glass is impregnated with epoxy resin and semi-cured to make a ply of prepreg. We discuss theIPC-A-600 or IPC-6012 standardrelated to base materials in the following section. Standards related to the...
(Package Limited) Pulsed Drain Current Maximum Power Dissipation c Linear Derating Factor Gate-to-Source Voltage Operating Junction and Storage Temperature Range Soldering Temperature, for 10 seconds (1.6mm from case) VGS TJ TSTG Avalanche Characteristics EAS (Thermally limited) IAR EAR Single Pulse ...
(Package Limited) Pulsed Drain Current Maximum Power Dissipation c Linear Derating Factor Gate-to-Source Voltage Operating Junction and Storage Temperature Range Soldering Temperature, for 10 seconds (1.6mm from case) VGS TJ TSTG Avalanche Characteristics EAS (Thermally limited) IAR EAR Single Pulse ...