内容提示: Philips Semiconductors Nijmegen PMOFIB-TEM sample preparationby in-situ lift-out techniqueHarry Roberts and Bert OtterlooPhilips Semiconductors, PMO department 文档格式:PDF | 页数:24 | 浏览次数:60 | 上传日期:2012-09-03 21:28:18 | 文档星级: ...
赛默飞世尔科技是 FIB-SEM 技术的行业领导者,在 DualBeam 仪器方面拥有超过 25 年的经验。我们为一系列应用提供了广泛的产品组合和先进的自动化能力,包括透射电镜 (TEM) 样品制备、亚表面和 3D 表征、纳米原型设计和原位实验。 TEM sample preparation
赛默飞世尔科技是 FIB-SEM 技术的行业领导者,在 DualBeam 仪器方面拥有超过 25 年的经验。我们为一系列应用提供了广泛的产品组合和先进的自动化能力,包括透射电镜 (TEM) 样品制备、亚表面和 3D 表征、纳米原型设计和原位实验。 TEM sample preparation TEM sample preparation TEM sample preparation is conside...
1.气体辅助蚀刻:虽然提高了研磨速率,但是增加了结晶-非晶界面的粗糙度,这进一步损害了TEM图像; 2.低能量FIB:在这些能量下蚀刻速率和位置的分辨率会受到影响,但是束能量的减少使损伤深度最小化; 3.氩离子研磨:原始的FIB损伤层被新形成的Ar离子感生损伤层代替,该层的厚度取决于氩离子束的能量、角度和时间(在研磨期...
A method for TEM sample preparation with backside milling of a sample extracted from a workpiece in an energetic-beam instrument such as a FIB-SEM is disclosed. The method includes rotating a nanomanipulator probe tip holding an extracted sample by an angle calculated according to the geometry ...
1.气体辅助蚀刻:虽然提高了研磨速率,但是增加了结晶-非晶界面的粗糙度,这进一步损害了TEM图像; 2.低能量FIB:在这些能量下蚀刻速率和位置的分辨率会受到影响,但是束能量的减少使损伤深度最小化; 3.氩离子研磨:原始的FIB损伤层被新形成的Ar离子感生损伤层代替,该层的厚度取决于氩离子束的能量、角度和时间(在研磨期...
我们为一系列应用提供了广泛的产品组合和先进的自动化能力,包括透射电镜 (TEM) 样品制备、亚表面和 3D 表征、纳米原型设计和原位实验。 TEM sample preparation TEM sample preparation TEM sample preparation is considered to be one of the most critical tasks in materials science research. However, it is ...
分析应用 定点切割 (Precision Cutting) 穿透式电子显微镜试片制作 (TEM Sample Preparation) IC线路修补和布局验证 (IC Circuit Editing and Verification) 制程上异常观察分析 (Abnormal Process Analysis) 晶相特性观察分析 (Ion Channeling Contrast for Grain Morphology Observation) ...
“Application of Automated FIB for TEM Sample Preparation in Semiconductor Failure Analysis,” 2014 10.2三维成像自动化 典型的 FIB 3D 数据采集包括数百到数千张图像的成像。为了使这一过程切实可行,数据采集和采集后数据处理都必须实现自动化。在整个数据采集过程中,靶标会被监控并用于跟踪切片铣削厚度和成像位置...
FIB SEM instruments for automated structural analysis, TEM sample preparation, and nano-prototyping. Contact us Focused ion beam scanning electron microscopy Scientists and engineers in both academia and industry are constantly facing new challenges that require highly localized characterization of a wide ...