商标名称 X-WAFER 国际分类 第09类-科学仪器 商标状态 商标已注册 申请/注册号 69148901A 申请日期 2023-01-09 申请人名称(中文) 拾斛科技(南京)有限公司 申请人名称(英文) - 申请人地址(中文) 江苏省南京市江北新区智达路6号智城园区2号楼720-82室 申请人地址(英文) - 初审公告期号 1841 初审公告日期 ...
X-Wafer is a Full-Automatic Flat Press System able to Laminate Wafers of different Dimensions and Thickness for High Performance Die Attach Applications. Based on Amx In Line Modular Station, it guarantees Flexibility and Accuracy during the Production Process. Fast Changeover Capability and Easy ...
I-CODE SLI-X WAFER芯片介绍 SL2S2002; SL2S2102 ICODE SLIX Rev. 3.2 — 10 January 2011 198332 Product short data sheet PUBLIC 1. General description The ICODE SLIX IC is a dedicated chip for intelligent label applications such as libraries, product authentication in different industries such ...
SL2S2102FUD wafer sawn, bumped wafer, 120 μm, on film frame carrier, C i between LA and LB = 97 pF (typical) - SL2S2002FTB XSON3 plastic extremely thin small outline package; no leads; 3 terminals; body 1 x 1.45 x 0.5 mm; ...
参考报价:面议 品牌:马尔文帕纳科 产地:荷兰 型号:Wafer XRD 200 样本:来电或留言获取样本 在线咨询 留言咨询 电话咨询 收藏 AI问答 马尔文帕纳科WaferXRD200X射线衍射仪价格? 可以检测什么? 马尔文帕纳科WaferXRD200X射线衍射仪参数规格? 配套的耗材试剂? 马尔文帕纳科WaferXRD200X射线衍射仪操作规程? 使用注意...
晶圆x射线晶体定向仪分拣系统Wafer XRD的Omega-scan方法: ◇ 高的精度 ◇ 测量速度: < 5秒/样品 ◇ 易于集成到工艺线中 ◇ 典型的标准偏差倾斜度(例如:Si 100): < 0.003 °,小于< 0.001 °。 全自动化的晶圆分拣和处理系统 Freiberg Instruments的单晶XRD定向仪主要里程碑: ◆ 1961 - EFG GmbH公司...
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通用的XBS200平台可以对尺寸最大为200毫米的晶圆进行对准的晶圆键合。它的多功能性和模块化设计为所有的永久性键合任务提供了最大的工艺灵活性。一种新颖的对准晶圆传输方法消除了传统系统的复杂性,并提供了一致的工艺结果和出色的系统可用性。XBS200平台为MEMS、LED和3D先进封装的大批量生产提供了低拥有成本。亮点...
Wafer-582X-CENET Ready-to-run solution for WinCE .NET INTRODUCTION The WAFER-582X-CENET is an embedded platform development kit which supports Windows CE .NET, used in conjunction with our Wafer-582X, the low power, high performance embedded CPU board. Pre-configured with WinCE .NET on the...
Rigaku's WaferX 310 represents the culmination of more than 40 years of experience in the X-ray fluorescence analysis of thin films on silicon wafers. Developed as an in-line metrology tool, it is ideally suited to 300 mm high-volume manufacturing environments. ...