◆ 1961 - EFG GmbH公司由X-ray Ing.集团亚瑟·布拉达切克和他的儿子汉斯·布拉达切克创立。 ◆ 1969 - 研制了世界上基于集成电路的x射线检测计数装置,名为 COUNTIX 130。 ◆ 1989 - 开发 Omega-Scan 方法 BOSCH 要求提供圆形石英毛坯的定向测量系统 - 振荡器产量从 50% 提高到 95% ◆ 2005 - 将 Omeg...
半导体 wafermap 分析方法包括显微镜分析、体视显微镜、X-ray 无损检测、C-SAM（超声波扫描显微镜）、I/V Curve advanced smart-1、SEM（扫描电镜/EDX能量弥散X光仪）、EMMI 微光显微镜、Probe Station 探针台测试、FIB（聚焦离子束）以及 ESD/Latch-up 静电放电/闩锁效用测试。显微镜分析（OM）用于检测...
XM8000 Wafer X-ray Metrology PlatformNordson DAGE
X-RAY Inspection (NDT)2nd BondingBroken Open Failure Short Failure Short Failure (Tin Whisker)Short Failure Leakage Failure Function Failure Assembled Related – Machine/Man Damaged Assembled Related – Environment (Particle Damaged)ESD Cases of Driver ICs Difference between ESD and EOS Major Mode of ...
Rigaku's WaferX 310 represents the culmination of more than 40 years of experience in the X-ray fluorescence analysis of thin films on silicon wafers. Developed as an in-line metrology tool, it is ideally suited to 300 mm high-volume manufacturing environments. ...
X-RAY Inspection (NDT) 2nd BondingBroken Open Failure Short Failure Short Failure (Tin Whisker) Short Failure Leakage Failure Function Failure Assembled Related – Machine/Man Damaged Assembled Related – Environment (Particle Damaged) ESD Cases of Driver ICs ...
We present a novel x-ray lithography based micromanufacturing methodology that offers scalable manufacturing of high precision optical components. It is accomplished through simultaneous usage of multiple stencil masks made moveable with respect to one another through custom made micromotion stages. The ra...
wafer术语 Wafer晶片 wafer alignment晶圓對準 wafer automatic transfer system晶圓自動傳送系統wafer breaking equipment晶圓劈開設備 wafer burn-in晶圓老化測試 wafer burn-in system晶圓老化測試系統 wafer cassette晶圓輸送盒 wafer chaner晶圓更換機 wafer cooling stage晶圓冷卻夾片臺 wafer disk晶圓圓盤 wafer distortion...
To attain the wafer architecture, X-ray Micro Tomography (XMT) was used on a sample to produce a stack of image slices which were reconstructed as a 3D virtual wafer. The microstructure of the volume was characterised in terms of porosity and then meshed with tetrahedral elements for finite ...
X-ray InspectionTSVWafer bumpCopper PillarCopper Pillar AlignmentVoidVoidingMeasurementThe emergence, development and use of Through Silicon Vias (TSVs) for the 2.5D and 3D integration of new products requires the availability of new inspection and measurement tools to validate TSV and 3D integration ...