許多IC製程後期都會進行晶圓背面研磨(Wafer Backside Grinding),使晶圓薄形化,以利後續晶圓切割及封裝製程。在晶圓背面研磨(Wafer Backside Grinding)此道製程上較容易發生,所謂的Wafer Warpage ,因為目前多複合性晶背材質上,對於每種金屬的延展性皆不一同,故高溫研磨後的變化更多。 例如在智慧卡(Smart Card)應用上,...
The utility model provides a warpage wafer loader, warpage wafer loader includes the wafer box, all is equipped with on the inner wall of wafer box both sides to be suitable for the protruding structure of placing the wafer, warpage wafer loader is still including being fixed in the strutting...
Electrostatic chuck (ESC), wafer warpage, wafer bow, BiCMOS INTRODUCTION In the course of semiconductor process flow silicon wafers develop bow and warpage due to different intrinsic properties of films added or removed to both front and back sides. However, there are process steps that require ...
网络薄片弯曲;会使晶片发生弯曲;会使芯片发生弯曲 网络释义
A wafer is subjected to stress (mechanical stress) during the production processes. In many cases, such stress is not equally applied to top and bottom sides of the wafer, resulting in warpage. Particularly at the polishing process, when stress on the machined surface is large, convex warpage...
Measurement of Wafer Warpage, Find Details and Price about Touch Screen Flatness Measurement PCB Flatness Measurement from Measurement of Wafer Warpage - Guangzhou GIEZHY Measurement Technology Co., Ltd
The key enabling technology for 3D integration is Wafer-to-Wafer (WoW) bonding. One of the main issues for the W2W bonding fabrication process is the wafer warpage. We explore the possibility of wafer warpage reduction considering the large material properties variation of the tetraethoxysilane (...
Wafer curvature becomes severe as the number of wafers in a stack increases, but the increment of wafer bow is reduced as the number of stack increases. The experimental results were also compared with the analytical model. Introduction 3D technology has been of great interest to microelectronic ...
用作名词(n.) The resulting benefits are high stiffness and load bearing at low weights and with low warpage. 最终带给产品的好处是在低重量和低翘曲情况下体现出的高刚性和承载能力。 To understand the mechanics of wafer warpage, research is performed on the effect of the lift-off procedure and ...
WAFER WARPAGE REDUCTION 专利名称：WAFER WARPAGE REDUCTION 发明人：Chun Hsiung Tsai,Shiang-Rung Tsai 申请号：US13936254 申请日：20130708 公开号：US20140264345A1 公开日：20140918 专利内容由知识产权出版社提供 专利附图：摘要：The present disclosure relates a method to mitigate wafer warpage in advanced ...