The invention vacuum wafer chuck and the wafer is placed (chuck) and the wafer chuck attached to the upper surface The extreme pending tape (expanding tape), and a semiconductor for removing sebum Words using the semiconductor die-attach device having a collet for sucking a semiconductor die ...
2.2 Overlay error induced by wafer warping A wafer that goes through high-temperature processes or film deposition can be warped, either due to stress release of introduction of new stress. When the wafer is flattened out at the wafer chuck of an exposure tool, the patterns on the wafer shif...
2. The wafer processing tool of claim 1, wherein the wafer holder is a clamp type holder, a chuck type holder, an e-chuck type holder, or a vacuum type holder. 3. The wafer processing tool of claim 1, wherein each of the at least one sensor set comprises a plurality of sensors ...
EVALUATION METHOD OF WARPAGE OF WAFER, AND SELECTION METHOD OF WAFER PROBLEM TO BE SOLVED: To provide a method which introduces a novel parameter indicating a difference in a correction degree of warpage caused by a difference in a pitch of a pin chuck in the case where a wafer is adsorbed...
The purpose of an ESC in metal deposition process is to clamp (chuck) down wafers against a back side gas flow which is used for temperature control.Chucking is achieved using a bipolar ESC which resembles a parallel plate capacitor with one of the plates being the wafer (see Figure 1 and...
A chuck configured to provide non-uniform displacement across a wafer can be employed to hold a wafer in a contoured shape for bonding with another wafer in a matching contoured position. Independently height-controlled pins can be employed to hold a wafer in a non-planar configuration.Senaka ...
The electrostatic chuck includes a clamping surface (13, 130) for clamping a wafer thereto by a clamping force that is dependent on a clamping voltage applied to the electrostatic chuck. The control arrangement is used to detect an inherent warpage in the wafer prior to a processing of that ...
A chuck configured to provide non-uniform displacement across a wafer can be employed to hold a wafer in a contoured shape for bonding with another wafer in a matching contoured position. Independently height-controlled pins can be employed to hold a wafer in a non-planar configuration.SENAKA ...
The warpage adjustment concept consists of subjecting the reconstituted wafer to a temperature that is equal or higher than its glass transition temperature (Tg) for specific dwell time. The wafer should then be placed on a cold thermal chuck, and a vacuum chuck should be used to lock the ...
A chuck configured to provide non-uniform displacement across a wafer can be employed to hold a wafer in a contoured shape for bonding with another wafer in a matching contoured position. Independently height-controlled pins can be employed to hold a wafer in a non-planar configuration.Raghuveer...