1. Flatness and warpage can be done for a single product or multiple products 2. Production line batch measurement mode and sampling measurement mode. 3. The monitoring value of flatness and warpage can be preset, and the alarm can be alarmed if the tolerance is out of tolerance 4. Te mea...
An innovative moire technique for full-field wafer warpage measurement is proposed in this study. The wafer warpage measurement technique is developed based on moire method, Talbot effect, scanning profiling method, stroboscopic, instantaneous phase-shift method, as well as four-step phase shift ...
The authors are grateful to Prof. Le Luo and Gaowei Xu from State Key Laboratory of Transducer Technology, SIMIT, China Academy of Sciences (CAS), for their help in theoretical calculation, wafer warpage measurement and useful discussions. Author information Publisher's Note Reprints and permissions...
wafer back grinding method. By enabling an outer support ring to the wafer (the TAIKO ring, Japanese for drum), back grinding is performed on the inner circular area of the wafer, while leaving an edge of a few millimeters unprocessed. Taiko simplifies thin wafer handling and lowers warpage....
Wafer Mounting Measurement System Downloads: Product-Sheet RAD-2512F/12 (Fully-Automatic Vacuum Mounter) 1. Equipped with pre-cut tape vacuum mounting function High-precision wafer mounting is achieved for wafers with specially shaped backside that makes difficult to mount with the roller method. ...
The equipment scans the surface of the circuit board through the high-precision line laser probe to obtain the contour data of the workpiece surface, and then calculate the flatness and warpage degree. It is suitable for high precision and fast non-contact measurement of warpag...
backside surface roughness, and die strength fully automatically. Efficient and highly accurate measurement is achieved by automating all of the existing manual processes. In addition, DIS100 records measurement data. Therefore, it also improves traceability, as required in quality audits of automotive ...
The Revolving Measurement Unit (RMU) houses up to 6 flexible sensors that are configurable with various pull, peel, push, or shear tools. This enables continuous testing up to 200 kgf. Read more Nano-precise shear height control The nano control shear sensor has a unique drive with a clo...
warpage of the substrate201for the preceding metallization layers and/or any subsequent metallization layers. In other cases, if a corresponding overall compressive stress level may have been determined during a corresponding measurement sequence, as previously described, the etch stop layer255may be ...
Therefore, process parameters and materials used in the processes for manufacturing the devices on the wafer 130 can be modified according to measurement result of the warpage of the wafer 130, thereby increasing process yield and reliability of product. FIG. 5A is a schematic view of a wafer ...