Here is a great resource that discusses system-level effects on solder joint reliability. All of the mitigation strategies mentioned above will not prevent solder joint reliability issues if the solder joint quality is poor. For this reason, it is imperative to construct PCBAs using a reputable m...
Solder joint reliability is often a pain point in the design of an electronic system. A wide variety of factors affectsolder joint reliabilityand any one of them can drastically reduce joint lifetime. Properly identifying and mitigating potential causes of solder joint failure during the design and...
It is asserted that lead-free solder joint acceleration factor modeling, when combined with actual test failure data, provides a fairly accurate and expedient way of assessing solder joint reliability. It also questioned whether lead-free...
This article presents lead free (SAC 305 alloy) solder joint reliability data with the gold finishes, namely ENIG, ENEPIG and DIG. SAC 305 is an alloy composed of Sn with 3.0% Ag and 0.5%Cu. SAC alloy has a melting point of 218°C compared to Sn/Pb at 183°C....
In this article, the solder joint reliability of thin and fine-pitch BGA (TFBGA) with fresh and reworked solder balls is investigated. Both package and board level reliability tests are conducted to compare the solder joint performance of test vehicle with fresh and reworked solder balls. For pa...
Lead-free solder joint reliability is a multi-faceted and challenging topic. Lead-free solders such as eutectic SnAg and SnBi have been used successfully in niche applications for many years. With the advent of no-lead (Pb) legislation, a multitude of soldering alloys has been proposed for mai...
The results indicate that backward compatible, mixed alloy assemblies should have acceptable reliability under service conditions. Complete or full Pb mixing is preferred in order to achieve consistent and acceptable solder joint reliability. Conclusions ...
Solder joint reliability 专利名称：Solder joint reliability 发明人：Ian Andrew Abraham,Andrew Siu Hing Liu 申请号：US09203850 申请日：19981202 公开号：US06246011B1 公开日：20010612 专利内容由知识产权出版社提供 专利附图：摘要：An electrical circuit arrangement comprising a circuit board and an electrical...