Solder joint reliability test summaryDescription, Part
test method fornmicrostructures to evaluate the relationship betweennfatigue life and load (non-linear strain generated in onencycle) using a test sample closely resembling the actualnstructure of a microsoldered joint, in order to measure thenfatigue strength characteristics of microsoldered jointsn...
In this article, the solder joint reliability of thin and fine-pitch BGA (TFBGA) with fresh and reworked solder balls is investigated. Both package and board level reliability tests are conducted to compare the solder joint performance of test vehicle with fresh and reworked solder balls. For pa...
Lead-free solder joint reliability is a multi-faceted and challenging topic. Lead-free solders such as eutectic SnAg and SnBi have been used successfully in niche applications for many years. With the advent of no-lead (Pb) legislation, a multitude of soldering alloys has been proposed for mai...
The use of BGA (Ball Grid Array) interconnects utilizing the lead-free solder joint has grown rapidly because of its small volume and diversity of application. Thus, it requires the continuous quantification and refinement of lead-free solder joint reliability. The lead-free solder creep and ...
The results indicate that backward compatible, mixed alloy assemblies should have acceptable reliability under service conditions. Complete or full Pb mixing is preferred in order to achieve consistent and acceptable solder joint reliability. Conclusions ...
Thermal cycle fatigue and JEDEC drop test solder-joint reliability were studied on a 0.65mm pitch 141MAPBGA package through in situ monitor of packages mounted on PCBs. The primary conclusions are: 1) The POR package (Ni/Au pad w/ SnAg ball) meets the goal of first failure greater than 15...
Considering the great importance of solder joint reliability to the device, it is a necessity to reinforce the overall performance of that. Solder, as the material that forms the solder joint, has been used in surface mounted technology, ball grid array package and chip size package etc. in ...
当芯片厚度从O .625mm 减小到0.500mm和0 .350mm时, 焊点的可靠性分别提高了约0 .7 5和1. 5倍.关键词: 芯片尺寸封装; 有限元分析; 焊点; 可靠性中图分类号: TN30 6文献标识码: A文章编号: 1001-2028(2011)08—0063-04ReliabilityanalysisandtestingofchipscalepackagesolderjointYANGHongzhen,CAOBaiyang,...
In package, its easy to have defects in the solder joint, for the request of environment protection, lead-free solder research is one of the most important topics now. In soldering, the adhesion, diffusion barrier, and wettability of the interface between UBM and a lead-free solder, and the...