Solder joint failure is a serious reliability concern in flip-chip and ball grid array packages of integrated-circuit chips. In current industrial practice, the solder joints take on the shape of a spherical se
Considering the great importance of solder joint reliability to the device, it is a necessity to reinforce the overall performance of that. Solder, as the material that forms the solder joint, has been used in surface mounted technology, ball grid array package and chip size package etc. in ...
Figure 1: Top View of a PolarPAK For a new-generation package like PolarPAK, it is im- perative to examine solder joint reliability. IPC-9701[1] guidelines are implemented for PCB design and tem- perature cycling. The latter induces thermal fatigue on solder joints, which in turn enables...
The results indicate that backward compatible, mixed alloy assemblies should have acceptable reliability under service conditions. Complete or full Pb mixing is preferred in order to achieve consistent and acceptable solder joint reliability. Conclusions ...
Norris, K C, and AH Landzberg. “Reliability of Controlled Collapse Interconnections.”IBM Journal of Research and Development13, no. 3 (1969): 266-271. Vasudevan, Vasu. and Fan, Xuejun. “AnAcceleration Modelfor Lead-Free (SAC) Solder Joint Reliability Under Thermal Cycling.”2008 Electronic...
Experimental reliability studies were conducted using the in situ measured temperature history as well as industry-standard temperature history. This article presents the influence of temperature history on solder joint fatigue life. In order to measure deformations in the solder joint under cycling ...
The cause of the improvement in thermal cycling reliability was analyzed using the (Al,Cu)-Sn, Si-Sn and Al-Sn phases dispersed around the CuSnintermetallic at the solder matrix and bonding interfaces. From these results, we propose the possibility of a mid-temperature Sn-0.5Cu(Pd)-Al(Si)...
A known approach to improving package reliability with respect to solder joint fatigue is to underfill components with an epoxy resin (or other substance having similar adhesive, non-electrically-conductive properties) in order to constrain movement of a package relative to a board. This results in...
, "Thermal cycling analysis of flip-chip solder joint reliability," Components and Packaging Technologies, IEEE Transactions on , Volume: 24 Issue: 4 , Dec 2001 pp. 705 -712.Pang John H L,Chong D Y,Low T H.Thermal cycling analysis of flip-chip solder joint reliability.IEEE Transactions ...
Furthermore the reliability of BGA solder joints in thermal cycling is evaluated by using the modified coffin-Manson criterion which may define and distinguish failure. Any change in circuit resistance according to the accumulated damage induced by the thermal cycling in the joint was recorded and ...