Solder jointConstitutive modelFatigue life predictionPBGA package StructureSolder joints are generally the weakest part in electronic packaging structure whose fatigue life depends to a large extent on the durability of solder joints. In pursuit of a balance between environmental protection and soldering ...
2016, International Journal of Fatigue Show abstract A continuum damage mechanics-based unified creep and plasticity model for solder materials 2015, Acta Materialia Show abstract A state-of-the-art review of fatigue life prediction models for solder joint 2019, Journal of Electronic Packaging Effects...
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part. It is well known that the life of solder joints mainly depends on these strains. In order to predict the life of a solder joint, first, the fatigue life of the solder is verified by a heat cycle test; second, the fatigue life curve is plot- ted based on the correlation between...
Finite Element Based SolderJoint Fatigue Life Predictions for a Same Die Stacked Chip Scale Bal l Grid Array Package Bret A.Zahn ChipPAC Inc.A..
Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS® that is designed for solder joint fatigue reliability analysis of electronic ...
The experimental solder joint fatigue life of these WLCSPs can be obtained by Weibull distribution according to the BLR TCT results. In order to establish a modified Coffin Manson equation for solder joint fatigue life prediction, the 3D finite element modeling with rate dependent material ...
A thermal fatigue life prediction model of a ceramic ball grid array (CBGA) solder joint assembly has been developed. This model was evolved from an empirically derived formula by correlating the solder nonelastic strain energy density i... TE Wong,HM Cohen,TY Jue,... - Advances in Electroni...
Solder fatigue is a major cause of failure in electronic assemblies over time and a serious concern across industries that manufacture electronics. As solder fatigues, it can result in solder joint failure, leading to a deformed or inoperable product that can negatively impact business, product ...
Solder joint fatigue life prediction using peridynamic approach is presented for the first time. The underlying premise is that material degradation through energy dissipative mechanisms play a central role in crack initiation and propagation, and that fatigue cracks follow paths similar to cracks form ...