For activation energy, a great source is a material scientist or chemist – second is your own detailed test data, and third is a literature search. Back when I was at HP and lead-free solders were coming to market we did a lot of solder joint fatigue testing as did many others. Over...
Solder Joint Reliability Prediction for Multiple Environments 10.1007/978-0-387-79394-8_10 Andrew E. Perkins and Suresh K. Sitaraman 10. Solder Joint Fatigue Failure under Sequential Thermal and Vibration Environmentsdoi:10.1007/978-0-387-79394-8_10Andrew E. Perkins...
This type of failure is typically seen on finer pitch components — primarily BGAs — or when especially brittle laminates are used. Pad cratering is a serious issue because it often leads to trace fractures. In contrast to fatigue cracks, which typically occur through the bulk of a solder jo...
The impact of design and material choices on solder joint fatigue life for fine pitch BGA packages is characterized. Package variables included die size, package size, ball count, pitch, mold compound, and substrate material. Test board variables included thickness, pad configuration, and pad size...
Solder joint reliability of SMT components connected to printed circuit boards is well documented. However, much of the testing and data is related to high-strain energy thermal cycling experiments relevant to product qualification testing (i.e, -55 °C to 125 °C). Relatively...
Finite Element Based SolderJoint Fatigue Life Predictions for a Same Die Stacked Chip Scale Bal l Grid Array Package Bret A.Zahn ChipPAC Inc.A..
Click the icon to view the PDF-file: Investigation of Solder Joint Reliability through Impact Fatigue Loading
As electronic equipment tends to be miniaturized and multifunctional, there will be a number of Joule heat generated on circuit chips, impacting the thermal fatigue life [2,3]. Considering the great importance of solder joint reliability to the device, it is a necessity to reinforce the overall...
Q. Guo and M. Zhao "Fatigue of SMT solder joint including torsional curvature and chip location optimization", Int. J. Adv. Manuf. Technol. , vol. 26, pp.887 -889 2005Guo Q, Zhao M. Fatigue of SMT solder joint including torsional curvature and chip location optimization....
A review of fourteen solder joint fatigue models is presented here with an emphasis on summarizing the features and applications of each fatigue model. The models are classified into five categories: stress-based, plastic strain-based, creep strain-based, energy-based, and damage-based. Fatigue mo...