Fatigue models falling outside these categories are categorized as 'other empirical models'. Each model is presented under one category with the relevant parameters and applicable packages. Following each category, common issues such as thermal cycling conditions, solder joint geometry, and coverage are...
Figure 2 shows the Weibull probability diagram of SAC305 solder joints under different stress amplitude cycles at 25℃. It can be clearly seen that when the stress amplitude increases, the fatigue life of the solder joint decreases. After identifying the relationship between characteristic fatigue lif...
Fatigue Life Model of Solder Joint The soldering of components generally requires the use of solder pastes as the connecting phase, which will form solder joints after reflowing. Due to various impacts that are often encountered in the daily use of components, the stress at the solder joint cont...
actual parts is still necessary for verifying the life pre- dictions. The necessity to model the fatigue behavior of solder joints has also been recognized by other investigators; as a result several solder joint fatigue models have been proposed. However, the assumptions and applica- ...
Global uncertainty analysis of solder joint fatigue life model in random vibration environment 来自 掌桥科研 喜欢 0 阅读量: 35 作者: Kao,Wu 摘要: The global model uncertainty analysis is to estimate the error due to input data approximations rather than sensitivities associated with finite ...
► A coupled thermo-mechanical cohesive zone model is proposed. ► The model is used to describe fatigue cracking in a solder joint. ► The model accounts for degradation of the interface thermal conductance with crack development. ► The number of cycles to failure is computed for the ...
Modeling Solder Joint Fatigue Life for Gullwing Leaded Packages: PartI- Elastic Plastic Stress Model. Journal of Electronic Packaging, Juin 1995... VK Gupta,DB Barker - 《Journal of Electronic Packaging》 被引量: 4发表: 1995年 Modeling solder joint thermal fatigue life for gullwing leaded ...
One way to approachaccelerated life testingis to use a model for the expected dominantfailure mechanism. One such model is for solder joint low-cyclefatigueoriginally published by Coffin (1954) and Manson (1953), independently. Norris-Landzberg ...
Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS® that is designed for solder joint fatigue reliability analysis of electronic ...
III. FINITE ELEMENT ANALYSIS FOR WLCSP For the purpose of correlating the solder joint fatigue life through simulation and BLR TCT, the 3D quarter model was constructed in FEA due to the symmetry feature. The maximum creep strain and/or creep strain energy density is typically located on the ...