PRODUCT DATA SHEET Indium8.9HF SnPb Solder Paste Features • Halogen-free per EN14582 test method • High transfer efficiency through small apertures (≤0.66AR) • Eliminates hot and cold slump • High oxidation resistance • Wets well to oxidized BGA and pad surfaces to eliminate head-...
Solder joint reliability of lead-free solder balls assembled with SnPb solder paste[A]. 2003.Horst Theuss,Thomas Kilger,Thonias Ort.Solder joint reliability of lead-free solder balls assembled with SnPb solder paste. Electronic components and technology conference . 2003...
Sign up with one click: Facebook Twitter Google Share on Facebook AcronymDefinition SnPbTin-Lead(Solder) SnPbSwedish National Police Board SnPbSyndicat National du Pompage du Béton(French: National Union of Concrete Pumping) SnPbSwedish National Property Board ...
(IMCs)layerbetweentheeutecticSnPbsolderandCusuhstrate.Ho wever,theSMT processparameter,especiallytheisothermaltimeandthethicknessofsolderpasteformboard ,changedtheshape andthicknessofIMCslayer. Keywords:Processparameter;Weldinginterface;IntermetallicCompoundslayer 1引言 表面贴装技术是一种先进的电子组装工艺技 术,...
Solder Paste Our solder paste is a mixture of finely powdered solder alloy and flux, which is used for surface mount technology (SMT) applications. It is ideal for soldering small and complex electronic components, such as integrated circuits, resistors, and capacitors. Our sold...
Wettability between ribbons of two lead SnAgPb (SAP) and SnPb (SP) solders, and a lead-free SnAgCu (SAC) solder on two Ag paste substrates at temperature r... HH Hsieh,FM Lin,FY Yeh,... - 《Solar Energy Materials & Solar Cells》 被引量: 29发表: 2010年 Transitioning to Pb-Free ...
表面贴装技术的工艺参数对共晶SnPb焊料与铜焊接界面的影响_肖代红
A Comprehensive Solder Joint Reliability Study of SnPb and:一个全面的焊点可靠性研究SnPb和a,of,焊点,Joint,joint,and,study,SnPb,Study,AND 文档格式: .pdf 文档大小: 1.58M 文档页数: 9页 顶/踩数: 0/0 收藏人数: 0 评论次数: 0 文档热度: ...
网络释义 1. 锡铅 锡铅(SnPb)锡膏,有铅焊锡膏,及时雨有铅焊膏 一口价 ¥ 110.00 卡夫特 K-1668电子黄胶 元器件定位胶 固定胶 溶剂胶 工业 … shop34197115.taobao.com|基于122个网页 2. 锡铅焊料 ...银铜焊焊料;免洗工艺;空气回流 35 图5-16锡铅焊料(SnPb) 图5-17 锡银铜焊料(SnAgCu) 36 图5-...
In this study, the influence of different reflow profiles and dosages of SnPb solder paste on the reliability of the SnAgCu/SnPb mixed assembly process was investigated. The interfacial microstructures were carefully examined through scanning electron microscopy, and two failures modes were found. ...