Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the ...
J. Pan, B. Toleno, T. Chou and W. Dee, "The Effect of Reflow Profile on SnPb and SnAgCu Solder Joint Shear strength", Soldering & Surface Mount Technology, vol. 18, no. 4, pp. 48-56, 2006.Pan Fianbiao; Brian F Toleno; Chou Tzu-Chien;.The effect of reflow profile on SnPb ...