Another thing to note is that immersion silver treated boards can tarnish if left exposed and subsequently they won't solder; so its double jeopardy with those boards. Bradley Fern, Entrust Datacard Absolutely agree with Jim's recommendation. All of the boards we ship to customers are vacuum ba...
SnPb/SnPb or Pb-free/Pb-free systems are more reliable than mixed metallurgy. Laminate selection is an important factor in Pb-free solder assembly integrit... P Cooke - Pcb West Conference & Exhibition: Santa Clara 被引量: 0发表: 2017年 ...
First, lead-free brazing material characteristics on the reliability of the solder joints higher melting point: lead-free brazing material melting point is generally around 217 ℃, than the traditional SnPb eutectic brazing material (melting point of 183 ℃) about 35 ℃ higher. The increased temper...
Each has its own pros and cons. The method is selected based on production environments, volumes, and flexibility needs. Comparison of PropertiesThe properties of traditional leaded HASL versus lead-free HASL are compared below: PropertyLeaded HASLLead-Free HASL Solder Alloy Tin-Lead (SnPb) Tin-...
The last edition of the TNM-based staging classification of lung cancer is based on the Mountain proposal published in 1997. However, due to the multiple m... S Elgobashi 被引量: 86发表: 2006年 Microstructure evolution of SnPb and SnAg/Cu BGA solder joints during thermal aging The microstru...
In reality, however, this point is never reached, because the equilibrium concentration between dissolving of the metal and byproduct removal is low. Base metals used in electronics have high dissolution rates in SnPb solder alloys. For wave soldering, the dissolved metals are "washed away" by ...
for packages with eutectic snpb (tin-lead) balls, use the following constant compressive loads: - 3g per solder ball for 0.5mm pitch mbga package - 6g per solder ball for 0.8mm pitch ubga package - 7g per solder ball for 0.92mm hex pitch fbga package - 8g per solder ball for...
for packages with eutectic snpb (tin-lead) balls, use the following constant compressive loads: - 3g per solder ball for 0.5mm pitch mbga package - 6g per solder ball for 0.8mm pitch ubga package - 7g per solder ball for 0.92mm hex pitch fbga package - 8g...
Figure 1 shows a cross-section of an IC package, which includes several key components along the electrical path such as C4bump on the top, main routing (microstrip or stripline with dual referencing), micro-vias, PTH, and ball grid array (BGA) solder balls on the bottom. Methods and des...
* SMOBC: Solder mask over bare copper, eliminating reflow of the SnPb, allowing smaller traces. The inevitable demise of SMT: printed electronics offer the best chance for a process revolution SMOBC (soldermask over bare copper) is a good process for minimizing the metal exposure of the plating...