Vassilev, G.; Lilova, K.; Gachon, J.C. Phase diagram investigations of the Ni-Sn-Bi system. J. Alloys Compound. 2009, 469, 264-269.Vassilev GP,Lilova KI,Gachon JC.Phase diagram investigations of the Ni-Sn-Bi system. Journal of Alloys and Compounds . 2009...
However, stability of the compound Ti2Ni2Sn in the Ti-Ni-Sn ternary system at 770 K is not so clear. According to ROMAKA et al [31], Ti2Ni2Sn was stable between 673 K and 1073 K, but it was not observed in the ternary phase diagram of the Ti-Ni-Sn system at 770 K [30]. ...
All the binary compounds, excluding Ni3Sn4, show a large solubility of the third element. The isothermal section at 873K, including 17 three phase fields, has been determined.doi:10.1016/j.intermet.2011.06.012Yuan YuanSimona DelsanteDajian Li...
Figure 5. Different stages of detachment of secondary dendrite arm during decelerated directional solidification of Sn-36at.%Ni peritectic alloy: (a) schematic phase diagram of Sn-Ni peritectic alloy; (Spbtea)rgitteeemIcItpiacenrrdaetaIucIrIte;io(dcni)sttsercmihbpeumetiroaatntiucirnderta...
Low-alloy (Ni-Sn-Ti) copper alloy A low-alloyed copper alloy suitable for use as a base material for a semiconductor includes 0.03 to 0.2% nickel by weight, 0.03 to 0.2% tin by weight; and 0.015 to 0.1% titanium by weight, the remainder being copper and common impurities. J Steeb -...
Phase diagrams and thermodynamic properties of ternary copper-silver systems Phase diagram and thermodynamic data for twenty ternary copper‐silver‐Xalloy systems—whereXrepresents Al,Au,Cd,Fe,Ge,In,Mg,Mn,Ni,P,Pb,Pd,Re,S,Sb,Se,Sn,T... YA Chang,D Goldberg,JP Neumann - 《Journal of Physica...
The phase diagram of the Y–Ni–Sn ternary system was constructed at 770K (050at.% Sn) and 670K (more than 50at.% Sn) in the whole concentration range using X-ray and EPM analyses. The interaction of the elements results the formation of ten ternary compounds at investigated temperatures...
The AuSn Pb section of the Au Pb Sn phase diagram The eutectic alloys of InSb-MSb where M is a metal of Mn, Ni, Fe, and Cr, have been directionally solidified at various rates of solidification in order to investigate the structure change due to the solidification condition, and the bou...
Phase equilibria of the Sn-Sb-Ni ternary system at 270°C are experimentally determined in this work. Experimental results reveal both the Sn 3 Sb 2 and β-SnSb phases, and thus the phase relationship near the Sn-rich corner differs from that in the 250°C isothermal section. Instead of ...
Ag-Sn焊料因其优异的综合性能,已替代传统Pb-Sn焊料并广泛应用于电子电路和电子封装领域.Ni/Pd金属涂层可有效提高焊点的可靠性以及使用寿命.精确的焊料体系相图热力学研究可为焊料成分的高效设计,焊料工艺参数优化及焊点可靠性的提高提供热力学基础.本工作基于CALPHAD(CALculation of PHAse Diagram)方法对Ag-Ni-Pd-Sn焊...