免费查询更多sn-3.0ag-0.5cu合金锡详细参数、实时报价、行情走势、优质商品批发/供应信息等,您还可以发布询价信息。
Model NO. Sn-3.0Ag-0.5Cu Flux Containing Containing Flux Extended Length <10mm Colour Grey Package 500g/Roll Transport Package Customized Specification 0.2 / 3 mm Trademark customized Origin China HS Code 8001202900 Production Capacity 6000 Tons Product Description...
Sn3.0Ag0.5Cu Slag Characteristic Syringe Method Continuous out of Tin Stability Extended Length <10mm Colour Grey Package 500g/Roll Transport Package Customized Specification 0.2 / 3 mm Trademark customized Origin China HS Code 8001202900 Production Capacity 6000 To...
Sn-3.0AG-0.5cu Solder Wire for Welding Material Diameter 0.3-3.0mm, Find Details and Price about Tin Wire Environmentally Friendly Tin from Sn-3.0AG-0.5cu Solder Wire for Welding Material Diameter 0.3-3.0mm - DONG GUAN CITY YOSHIDA WELDING MATERIALS CO.,
关键词:Sn310Ag015Cu ,倒装,焊点,电迁移 PACC :7155D ,7290,7340J 3“十一五”总装备部预研项目(批准号:51323060305)和信息产业部电子第五研究所科技发展基金(批准号:XF0726130)资助的课题. 通讯联系人.E 2mail :yudonglu @yahoo.com.cn 11引言 电迁移是金属线在电流和温度作用下产生的金属迁移现象.有关...
To improve solder-joint reliability, the Sn–3.0Ag–0.5Cu (SAC) solder had minor Ge and Pd additions to form composite solders. The results indicated that the Cu6Sn5 and Cu3Sn phases formed at the SAC–xGe/Cu interface (x = 0, 0.5, 1.0, 2.0 wt.%) and the Ag3Sn phase ...
Sn-3.0Ag-0.5Cu真空再流焊工艺技术研究
哈尔滨理工大学硕士学位论文Sn-3.0Ag-0.5Cu-XNi钎料及焊点组织和性能研究姓名:***请学位级别:硕士专业:材料加工工程指导教师:**凤20090301哈尔滨理T人学T.学硕lj学位论文Sn.3.0Ag.0.5Cu—XNi钎料及焊点组织和性能研究摘要近年来随着微电子、表面组装技术(SMT)的发展,研制面向21世纪的绿色钎料产品以取代传统的Sn.Pb...
2013 pp.341?350 BGA Sn?3.0Ag?0.5Cu/CuIMC ,510640 , BGA Sn?3.0Ag? 0.5Cu/Cu IMC ,217 ,; 218 , β?Sn , Cu ,CuIMC217 ; 230,, IMCIMC , Cu Sn Cu Sn ,? IMC 6 5 3 ,, ,,TG113 A 0412?1961201303?0341?10 THE INTERFACIAL REACTION AND INTERMETALLIC COMPOUND GROWTH BEHAVIOR OF ...
(单晶Cu的[034]拉伸方向与焊接面夹角)的Sn-3.0Ag-0.5Cu焊料/单晶Cu焊接偶界面化合物层组织结构特点和拉伸力学性能的研究,发现在不同焊接角度的焊接偶接合处,靠近基体Cu一侧都有一层致密且较薄的Cu3Sn化合物层,厚度约为0.5μm,接着是Cu6Sn5化合物层;在焊料的内部,有Cu6Sn5和Ag3Sn晶粒,Ag3Sn呈颗粒状或...