A memory cell array (20) provided with memory cells (M) at respective intersecting points of a plurality of word lines (WL1-WLm) and a plurality of bit lines (BL1-BLn), a bit line selecting circuit (21) which is in connection with the plural bit lines (BL1-BLn) and selects the pl...
PROBLEM TO BE SOLVED: To reduce a test cost of a whole function test performed for a semiconductor memory provided with a security circuit. SOLUTION: Input pattern data IP and output expected value data EP are stored in a buffer of a memory dedicated tester 30. An address included in the ...
Memory Chips From the perspective of functionality,semiconductormemory chips store data and programs on computers and data storage devices. Random-access memory (RAM) chips provide temporary workspaces, whereas flash memory chips hold information permanently unless erased. Read-only memory (ROM) and...
A repair I/O fuse circuit of a semiconductor memory device includes a reduced by as much as half layout area of fuses by replacing what one repair I/O information is represented by existing two I/O fuses with what one repair I/O information is represented by one I/O fuse. The repair ...
Collaboration spans interface and memory IP utilizing 2nm gate-all-around BSPDN technology and AI-driven reference flows to facilitate the development of advanced, energy-efficient chips SAN JOSE, Calif., December 10, 2024 - Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced it is ...
The semiconductor memory industry has long been a strategic priority for China’s economic development. Chinese companies purchase more than 30% of the NAND and DRAM products manufactured by global IDMs, while China’s self-sufficiency in memory is currently estimated to be below 15%. ...
In standard computer architecture, a central processing unit (CPU) or host processor can access only DRAM slotted into a dual in-line memory module (DIMM). In other words, the upper limits of how much memory a CPU can access are defined by the maximum capacity of DIMM. For ...
Major applications supported by SEAL include AI, SoC, ADAS, Radars, SDR, IoT, Data Center, Communication, Power, HPC, multi-core, cache coherency, memory, Signal/Image/Audio Processing and Cyber Physical Systems. Major standards supported are UCIe, PCIe6.0, Gigabit Ethernet, AMBA AXI, TSN, ...
In the early 1990s, thanks to its innovation in production, the cheap labor force and the improvement of capability, the Japanese semiconductor producers had greatly enlarged their market share of DRAM (Dynamic Random Access Memory). In contrast, the DRAM market for the American semiconductor ...
battery-powered consumer devices in the ultra-competitive markets for products such as tablets, laptop computers, and augmented/virtual reality (AR/VR) headsets. This new demand in consumer electronics is forcing FPGA manufacturers to rethink the architecture of their products in a bid to provide hi...