A semiconductor wafer partitioned into a multiplicity of chip areas defined by a grid-like array of scribe lines inscribed into the surface of the wafer, wherein each scribe line is longitudinally bounded by respective field oxide layers formed in the surface of the wafer, to thereby define a...
在一个晶圆上通常有几百个至数千个芯片连在一起。它们之间留有80μm至150μm的间隙,以便于划片,这些间隔结构被称为切割通道(dicing channel),有时也被称为划片槽(scribeline)锯道(sawchannel)或通道(street)。 简介 将每一个具有独立电气性能的芯片分离出来的过程叫做划片或切割(Dicing Saw)。因此,在设计这些...
在晶圆制造过程中,scribe line(划片线)和saw line(锯片线)是两个非常关键的概念,它们在晶圆的后段工艺中扮演着重要的角色。为了方便理解,我们可以把晶圆比作一块大饼,而每一片芯片就像是从大饼上切下来的薄片,划片线和锯片线则是切割这些薄片的“指引”和“路径”。 Scribe Line(划片线) 定义:划片线是晶圆表面...
Wafer scribe line structure for improving IC reliabilityA semiconductor wafer having a multi-layer wiring structure is disclosed. The wafer comprises a plurality of chip die areas arranged on the wafer in an array and scribe line areas between the chip die areas. The scribe lines of a ...
特别是passivation与glassivation的作用与区别？谢谢passivation钝化层，起保护作用，scribeline划片道，die与...
特别是passivation与glassivation的作用与区别？谢谢passivation钝化层，起保护作用，scribeline划片道，die与...
A semiconductor wafer partitioned into a multiplicity of chip areas defined by a grid-like array of scribe lines inscribed into the surface of the wafer, wherein each scribe line is longitudinally bounded by respective field oxide layers formed in the surface of the wafer, to thereby define a...
专利名称：Semiconductor wafer having scribe line test modules including matching portions from subcircuits on active die 发明人：Tathagata Chatterjee,Joseph P.Ramon,Patricia Vincent 申请号：US12760650 申请日：20100415 公开号：US08134382B2 公开日：20120313 专利内容由知识产权出版社提供 专利附图：摘要：A ...
MC-FSWH4 4" Round Wafer Holder for FlipScribe CWBR-100 Cleanbreak Pliers CWBR-100 Cleanbreak Pliers Small Sample Cleaving Pliers FlipScribe replacement cartridge Downsizing a Silicon (111) wafer with the FlipScribe RequestAQuote DownloadPDF Copy ...
The present invention relates to an overlay mark alignment method of a semiconductor wafer in which the overlay mark for one device region and the overlay mark for the other device region are formed on one scribe line, wherein the overlay mark for one device region and the overlay mark for ...