The rim area is scribed off the wafer, leaving a recrystallized silicon-on- diamond (FIG. 1d). The structure top to bottom is recrystallized silicon- diamond and silicon- substrate. The structure is similar to ZMR SOI, but the insulator here is diamond instead of silicon dioxide and is ...
The present invention relates to a method and apparatus for forming cracks in substrates made of glass, sintered ceramic, single-crystal silicon, sapphire, semiconductor wafer, ceramic and other brittle materials to scribe and break the same, and more particularly to a method and apparatus for form...
200 mm × 200 mm movement range clambing and fine adjustment (for x- and y-axis available) MR 200 – the ideal tool for REM- preparations in semiconductor technology The structure and the equipment of the MR 200 make the highly exact cutting and breaking possible of structured silicon wafer...
Ni/diamond dicing blades is the main tool for scribe of silicon wafer at present. In order to decrease the width of dicing slot on the wafer, it is necessary to reduce the thickness of blades, and to increase the hardness, toughness and wear resistance of the Ni/diamond composite coatings...
scribe line to cancel a skewed position of the mother substrate; the first and second scribing means each are configured to form a deep vertical crack during scribing along the scribe lines which reach the respective inner surfaces of the two brittle material substrates of the bonded brittle ...
surface of the block. A 2-cm by 2-cm piece of a silicon wafer was clamped to the center of the block using standard steel clamps. Prior to this, the silicon sample had been cleaned in and ultrasonic bath containing ethanol and then polished with Harris Diamond 1–10 micron grit powder....