A semiconductor wafer partitioned into a multiplicity of chip areas defined by a grid-like array of scribe lines inscribed into the surface of the wafer, wherein each scribe line is longitudinally bounded by respective field oxide layers formed in the surface of the wafer, to thereby define a...
The scribe line is aligned with the pivot line and relative movement between the vacuum chucks causes bending forces to be applied to the wafer and breakage of the wafer along the scribe line.doi:US8220685 B1Paul C. Lindsey Jr.Christopher K. Lindsey...
专利名称：Semiconductor wafer having scribe line test modules including matching portions from subcircuits on active die 发明人：Tathagata Chatterjee,Joseph P.Ramon,Patricia Vincent 申请号：US12760650 申请日：20100415 公开号：US08134382B2 公开日：20120313 专利内容由知识产权出版社提供 专利附图：摘要：A ...
PURPOSE: To reduce the warpage of a semiconductor wafer. ;CONSTITUTION: A thick oxide film 4' as insulator on a silicon wafer is formed in an island type. Stress inside an element can be disperesed outside scribe lines 5, and the warpage of a wafer as a cluster of elements can be pre...
The ATE will also test circuitry along the scribe lines. Performance of the device can be rated when using line test structures. There are companies that get a good amount of information by using this process. There are some dies that include internal spare resources that are used for repairs...
Semiconductor wafer with scribe lines having inspection pads formed thereonYukihiro TeradaKenichi Miki
The rear surface of the semiconductor wafer 50 is heated with a laser beam to form a laser spot, along a scribe line formation line for dividing the semiconductor wafer into a plurality of semiconductor chips, to a temperature lower than a softening point of the semiconductor wafer, while an...
A semiconductor wafer (10) and associated methods are disclosed in which a plurality of semiconductor dice (14) include a semiconductor substrate (12) overlain by a plurality of upper layers (13) and provided with encompassing scribe streets (20) at the top surface (16) of the wafer (10)...
A semiconductor wafer is provided that includes at least two integrated circuits (ICs); a scribe line extends adjacent to the at least two ICs; and a first conductor extends within the scribe line and is electrically coupled to the at least two ICs.JOHN JUDE O'DONNELL...
Method of dicing semiconductor wafer along protective film formed on scribe linesAccording to the invention, a protective film which is separated from an integrated circuit part and partly buried in the semiconductor wafer is formed in the surface region of semiconductor wafer along a scribing line ...