2.5D Package: I-Cube™ & H-Cube™ I-Cube™ deploys parallel horizontal chip placement to boost performance while combating heat build-up. Samsung’s Through Silicon Via ( TSV ) and Backend-of-the-line ( BEOL ) technologies form a foundation for two or more chips to harmonize their ...
2.5D Package: I-Cube™ & H-Cube™ I-Cube™ deploys parallel horizontal chip placement to boost performance while combating heat build-up. Samsung’s Through Silicon Via ( TSV ) and Backend-of-the-line ( BEOL ) technologies form a foundation for two or more chips to harmonize their ...
品玩11月11日讯,据cnbeta报道,三星电子宣布了新的 2.5D 封装解决方案 H-Cube(Hybrid Substrate Cube,混合基板封装),将专门用于需要高性能和大面积封装技术的 HPC、AI、数据中心和网络产品的半导体。三星电子高级副总裁兼代工市场战略团队负责人 Moonsoo Kang 表示:“H-Cube 解决方案是与三星电机(SEMCO)、A...
H-Cube™:H-Cube™是混合基板应用结构,它是精细图案ABF(Ajinomoto Build-up Film)基板和HDI(高密度互连)基板的组合,允许大尺寸进入I-Cube™ 2.5D封装。H-Cube™ 解决方案适用于需要集成大量硅芯片的高性能系统。为了增强 H-Cube™ 解决方案的可靠性,三星应用了其专有的信号/电源完整性技术,该技术可以稳...
'H-Cube' applies advanced silicon interposer technology and hybrid-substrate structure, allowing efficient integration of 6 HBMs, as well as lower cost benefit
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The recent announcement of the co-development of Hybrid-Substrate Cube (H-Cube) solution, which offers efficient integration of 6 HBMs and cost benefit, is one of the successful examples of Samsung foundry’s collaboration with the OSAT community. SAFETM-Cloud Design Platform: SAFETM-CDP, the...
event started off with the biggest lineup among the three locations with 14 new products including: the Bespoke French Door Refrigerator with AI Family Hub™+, Bespoke Infinite Induction Line, Bespoke AI Laundry Combo™, Bespoke Jet Bot Combo™ AI, Bespoke Jet AI™, Bespoke Cube™ Air...
待机最长时间 2G: 295 h (12.3 一天)3G: 315 h (13.1 一天) 标准电池 Li-Ion 960 mAh Buy powerbank 快速充电 包裝中包含的充電器 无线充电 手机存储 30 MB Buy memory card Memory cards microSD (为 2 GB) 标准 GSM, UMTS 阅读更多 Touchscreen 双SIM卡 其他信息 Sorry, additional...