2.5D Package: I-Cube™ & H-Cube™ I-Cube™ deploys parallel horizontal chip placement to boost performance while combating heat build-up. Samsung’s Through Silicon Via ( TSV ) and Backend-of-the-line ( BEOL ) technologies form a foundation for two or more chips to harmonize their ...
2.5D Package: I-Cube™ & H-Cube™ I-Cube™ deploys parallel horizontal chip placement to boost performance while combating heat build-up. Samsung’s Through Silicon Via ( TSV ) and Backend-of-the-line ( BEOL ) technologies form a foundation for two or more chips to harmonize their ...
標註>I-Cube™
根据插入器类型,I-Cube™ 可用于 I-CubeS™ 和 I-CubeE™ 衍生产品。 I-CubeS™:I-CubeS™ 凭借出色的翘曲控制,即使在使用大型中介层的情况下,也能带来令人印象深刻的带宽和令人惊叹的性能。超低信号损失与高存储密度相结合,同时热效率控制也大幅提高。 I-CubeE™:I-CubeE™具有硅嵌入式结构,通...
Samsung Electronics has announced the availability of its 2.5D packaging technology semiconductor components known as Interposer-Cube4 (I-Cube4).
藉由三星14奈米製程與I-Cube TM封裝技術 百度昆倫晶片將擴大AI生態系並巔覆使用者體驗 全球先進半導體技術領導品牌三星電子今日宣佈,與互聯網搜尋引擎服務供應商百度,共同開發的首款雲端邊緣AI加速器「百度昆倫」,預計將於明年初投入量產。 百度昆侖晶片設計奠基於該公司針對雲端、邊緣運算和AI應用,而自主研發的尖端神經...
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USB C Charger Block Charging Station: 100W 6 Port GaN Fast Charging Brick Hub Cube Box - PD 3.0 Type C & USB A Wall Charger Power Adapter for All i... amazon.com/dp/B0D815Z5SL?ref=ppx_pop_mob_ap_share Our 6-in-1 USB Charging Station, a convenient and versatile solution for all...